[News] Xiaomi XRING O3 Reportedly Features CXMT LPDDR6, TSMC 3nm, May Expand TSMC Ties to AI and Auto Chips

Xiaomi is stepping up its in-house chip push with the launch of the XRING O3, bringing LPDDR6 support to its latest flagship mobile processor. According to Cailian Press, the XRING O3 is the world’s first flagship mobile processor (SoC) to support LPDDR6 memory, with Chinese memory leader CXMT serving as Xiaomi’s key LPDDR6 memory partner. The report adds that the launch marks the first use of domestically developed Chinese LPDDR6 memory in a flagship processor.

While CXMT is supplying the O3’s LPDDR6 memory, Xiaomi is reportedly relying on TSMC for the chip’s manufacturing. Reuters notes, citing sources, that TSMC will produce the XRING O3 on its 3nm process. As noted by Wccftech, while the O3 does not move to TSMC’s latest 2nm technology, Xiaomi has introduced a range of improvements on the 3nm N3P node. The report notes that the O3 features around 24 billion transistors, up from 19 billion on the O1, while its die size has increased to 133 mm² from 109 mm².

Xiaomi is also expanding its XRING chip lineup and its use of TSMC manufacturing. Reuters notes that the company has reportedly tapped TSMC for two other XRING chips: the 6nm XRING O100 neural processing unit for its MiMo large language model on consumer devices, and the 3nm XRING D100 for autonomous driving. Xiaomi says the O3 is already in mass production, while the O100 and D100 have completed development and are set for deployment next year, Reuters notes.

The XRING O3 is expected to power Xiaomi’s upcoming flagship foldable phone, with shipments targeted at 200,000 to 300,000 units, according to Reuters. Jiemian News further identifies the device as the Xiaomi 18 Fold, which is scheduled to launch in September. The Xiaomi Pad 9 Pro Max will also feature the new chip.

CXMT Accelerates LPDDR6 Push as Competition Takes Shape

The XRING O3 milestone comes as CXMT accelerates its broader push into LPDDR6. As noted by a Yicai report earlier this month, sources say CXMT has already provided LPDDR6 samples to key customers, with a product launch and mass-production ramp potentially coming in the second half of 2026. CXMT’s progress could put it among the earliest suppliers to mass-produce LPDDR6 globally. SK hynix is also moving quickly, having announced in March that it was the first globally to complete development and validation of 16Gb LPDDR6 based on its 1c, or sixth-generation 10nm-class, process. The company plans to complete mass-production preparations in the first half of 2026 and begin shipments in the second half, according to Yicai. Samsung and Micron are also advancing LPDDR6, though neither has disclosed a clear mass-production timeline, the report adds.

Against this backdrop, Yicai points out that if CXMT completes LPDDR6 R&D validation and begins mass production in the second half of 2026, it could become one of the world’s earliest LPDDR6 suppliers, putting it in direct competition with SK hynix.

Read more

• [News] Xiaomi Unveils 3nm XRING O3, Reportedly First Mobile Chip to Support LPDDR6; Debuts on Xiaomi 18 Fold
• [News] Huawei Reportedly Readies Mate 90, XT2 for Sept. with Tau Scaling Chips Said to Match 3nm Performance

(Photo credit: Xiaomi)