[News] Xiaomi Unveils 3nm XRING O3, Reportedly First Mobile Chip to Support LPDDR6; Debuts on Xiaomi 18 Fold

Xiaomi has unveiled the long-awaited XRINGO3 on August 24. According to EE Times China and IT Home, the 3nm chip is the world’s first mobile processor to support LPDDR6, delivering speeds of up to 10,667Mbps and memory bandwidth of 113.8GB/s, a 48% increase over the XRING O1.

Jiemien News adds that the Xiaomi 18 Fold will debut with the XRING O3 when it launches in September. The Xiaomi Pad 9 Pro Max will also use the new chip. Xiaomi, according to IT Home, says the XRING O3 packs 24 billion transistors, 26% more than its predecessor, while its die size comes in at 133mm².

IT Home further explains that Xiaomi launched the XRINGO1 and XRING T1 in May last year. As China’s first flagship SoC built on a 3nm advanced process, the XRINGO1 powers the Xiaomi 15S Pro and two flagship tablets in the Xiaomi Pad 7 series, the report adds.

Key Highlights of XRINGO3

EE Times China reports that the XRING O3 brings major upgrades across its AI, CPU and GPU subsystems. Its NPU has been completely redesigned for Xiaomi’s MiMo on-device AI models, delivering up to 200 TOPS of tensor performance and 3.13 TFLOPS of vector performance, while boosting on-device AI performance by 45%, the report suggests.

The chip also adds two AI acceleration units to the CPU and eight neural-network accelerators to the GPU, further expanding its AI capabilities, EE Times China suggests. Xiaomi has also revamped the chip’s internal architecture to improve power efficiency and responsiveness, achieving a claimed 82ns latency, which it describes as industry-leading.

XRING O100: Xiaomi Unveils 3D-Stacked AI Accelerator

XRING O3 was not the only major launch at Xiaomi’s chip briefing. According to Jiemien News, Xiaomi also unveiled the XRINGO100, an AI accelerator designed for large AI models. Data shared by Xiaomi CEO Lei Jun on Weibo shows that the chip uses 6nm 3D wafer-on-wafer (WoW) stacking and delivers bandwidth of up to 1.22TB/s.

EE Times China reports that XRINGO100 is the industry’s first 6nm WoW 3D advanced packaging solution, using hybrid bonding to achieve a 1.4µm bonding pitch. Its on-device inference speed reaches up to 330 tokens/s, while its bandwidth is said to be 16 times that of conventional flagship smartphones.

Xiaomi also introduced the XRING D100, which IT Home describes as China’s first 3nm high-compute AI chip for intelligent driving. The chip, according to the report, has completed development and is slated for commercial deployment next year.

The D100 combines a 20-core high-performance CPU with a 16-core NPU and supports up to 160GB of unified memory, enough to locally run AI models with up to 200 billion parameters, according to IT Home.

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(Photo credit: Le Jun’s Weibo)