[News] China Pushes Glass Substrate: BOE Reportedly Eyes Post-2026 Mass Production, Visionox Joins the Race

China is stepping into the semiconductor glass substrate efforts. According to ETNews, industry sources say that Visionox, one of China’s leading display manufacturers, is set to ramp up investment in glass substrates this year. To support the move, the company has been building out its materials and equipment supply chain since the second half of last year.

As noted by Chinese media outlet Suzhou News, Visionox’s glass substrate initiative forms part of its recently announced expansion plan, under which the company is investing RMB 5 billion in a new project. Once operational, the project is expected to strengthen the display industry chain while accelerating the commercialization of broader semiconductor initiatives, including its X-ray and glass substrate projects.

ETNews also notes that China-based printed circuit board (PCB) manufacturer AKM Meadville is also preparing to supply glass substrates. The company has already established a prototype pilot production line. AKM Meadville is considered the world’s eighth-largest player in the high-density interconnect (HDI) substrate segment, the report adds.

Chinese Players Expand Presence in the Glass Substrate Market

Chinese companies are increasingly moving into the glass substrate space. As noted by Cailian Press, WG Tech, through its wholly owned subsidiary TGV Tech, is focusing on glass-based TGV (Through-Glass Via) technology, and its glass-based substrates for 1.6T optical modules have already completed small-batch sample deliveries, though the related revenue currently represents only a small portion of the company’s overall revenue.

Earlier, BOE, China’s largest display manufacturer, also moved into the semiconductor glass substrate business. As noted by ijiwei, BOE has deployed standardized glass core substrates featuring high strength and low warpage, primarily targeting AI chips, with mass production slated for after 2026.

China’s Glass Substrate Push Gains Momentum Across the Supply Chain

China already has multiple companies involved in the glass substrate space, spanning the entire industry chain. As noted by ICViews, on the equipment side, manufacturers such as Han’s Laser have begun delivering domestically produced TGV laser drilling equipment. Packaging companies are also accelerating. For instance, Tongfu Microelectronics has already developed TGV packaging capabilities and is expected to achieve product-level applications in the 2026–2027 timeframe.

Read more

• [News] LG Reportedly Delays Glass Substrate Commercialization to 2030 on Demand Uncertainty
• [News] DNP Advances TGV Glass Substrates, Eyes Early-2026 Sample Shipments, FY2028 Mass Production

(Photo credit: WG Tech)