[News] OCP 2025: Taiwan’s Tech Giants Flex AI Muscle Across Servers, Power, Cooling, and Networking

Taiwan is making its largest-ever presence at the Open Compute Project (OCP) Global Summit 2025, held October 13–16 in San Jose, California, amid soaring AI computing demand, according to Commercial Times. Companies led by Delta Electronics, Lite-On Technology, Wiwynn, and QCT are showcasing a full spectrum of solutions—from rack power and liquid cooling to complete server systems—demonstrating Taiwan’s end-to-end strengths in AI infrastructure, the report notes.

As Commercial Times notes, spearheaded by Meta, the OCP Summit is the key barometer for the AI server industry. This year’s theme, “Leading the Future of AI,” reportedly highlights open architectures, sustainable designs, and high-performance computing for AI data centers.

According to the Economic Daily News, alongside global tech giants like NVIDIA, AMD, Arm, Meta, Google, Microsoft, Cisco, Broadcom, Marvell, and Samsung, Taiwan’s presence has surged in recent years, with around 20 Taiwanese companies participating in this year’s event— even including IC design powerhouse MediaTek.

Taiwan’s Server Firms Step into the Spotlight

According to Commercial Times, Taiwan’s OCP participation this year spans server systems, power supplies, thermal solutions, and networking—underscoring the island’s pivotal role in global AI infrastructure supply chains.

The Economic Daily News reports that all major Taiwanese server and system makers are making a strong showing this year—including QCT, Wiwynn, Wistron, Inventec, Pegatron, ASUS, MSI, Compal Electronics, and GIGABYTE. Industry watchers cited by the report expect these companies to showcase cutting-edge servers and rack solutions compatible with multi-vendor platforms from NVIDIA, AMD, and Intel.

Power & Cooling Innovations

On the other hand, Commercial Times points out that the summit unveils cutting-edge innovations in energy and thermal management for the AI computing era, including megawatt-scale racks, high-voltage direct current distribution, liquid cooling, two-phase immersion cooling, and solid-state fans.

On the power side, the report suggests Lite-On Technology will showcase its latest megawatt-scale data center solutions, emphasizing high-efficiency power conversion and intelligent energy management aimed at green cloud operations and sustainable AI development.

In thermal management, Taiwan’s Auras Technology is reportedly unveiling end-to-end liquid cooling solutions, including cooling distribution units (CDUs) with liquid-to-air and liquid-to-liquid setups, plus automated coolant refill robots. Meanwhile, Sunonwealth highlights modular liquid cooling systems built to handle the soaring heat densities of next-generation AI workloads, according to Commercial Times.

On the other hand, Alpha Networks, as per the Economic Daily News, announced the development of a 1.6T water-cooled switch powered by Broadcom’s Tomahawk 6 chip, aiming to capture the AI data center and next-generation core network markets, with a debut expected at the summit.

Memory and Networking Architectures Evolve for AI Scale

Notably, AI’s expanding scale is also driving memory and network innovations, Commercial Times reports, adding that this year’s OCP places special emphasis on composable memory systems and CXL memory pooling applications, boosting performance through dynamic compression and resource sharing.

(Photo credit: Delta Electronics’ X)