[News] NexChip, Silan and Hua Hong Step Up Efforts in Advancing Mature-Node Foundry
The global semiconductor industry is shifting its focus from the race for advanced nodes to competition over supply chain resilience in mature processes. Chinese foundries are stepping up efforts in capacity expansion, process upgrades, and ecosystem development in a move to seize the opportunities.
Recently, Nexchip Semiconductor, Silan Microelectronics, and Huahong Group have each unveiled major developments, targeting process breakthroughs, fab construction, and ecosystem enhancement, respectively.
Nexchip: Completed 28nm Platform and Expands Mature-Node Capacity
On March 11, 2026, Nexchip announced that its 28nm logic process platform has completed full-process development.
Focused on 12-inch wafer foundry services, Nexchip has established a diversified process portfolio ranging from 150nm to 28nm. Its capabilities cover a wide range of applications, including display driver ICs (DDIC), CMOS image sensors (CIS), power management ICs (PMIC), logic ICs, and microcontrollers (MCUs), serving end markets such as smartphones, flat-panel displays, security, and automotive electronics.
On the capacity front, Nexchip has outlined its Phase IV expansion plan, which includes building a new 12-inch fab with a monthly capacity of 55,000 wafers. The new line will focus on 40nm and 28nm nodes, aiming to address ongoing capacity shortages in mature processes.
Silan Details Xiamen 12-Inch Advanced Analog Fab Project
In March 2026, Silan Microelectronics disclosed further details regarding its planned 12-inch advanced analog IC production line in Xiamen.
Currently, while most Chinese domestic 12-inch fabs are concentrated in logic and memory, there remains a significant capacity gap for high-end analog chips. As one of the few Chinese IDMs with full-process capabilities, Silan is expected to leverage design–manufacturing synergies to help alleviate bottlenecks in advanced analog production.
Huahong Establishes Huayao Semiconductor to Strengthen Ecosystem
According to corporate registry data, Shanghai Huayao Semiconductor Co., Ltd. has recently been established with a registered capital of CNY 1 billion, fully funded by Huahong Group. The move represents a key step in strengthening its semiconductor ecosystem.
Huayao Semiconductor’s business scope spans IC manufacturing, chip production, design, sales, and related services, forming a complete “design–manufacturing–sales” value chain capable of addressing diverse industry needs.
As a leading domestic semiconductor player, Huahong has built a comprehensive industrial footprint covering manufacturing, design, and sales, with three 8-inch and four 12-inch production lines and a patent portfolio exceeding 20,400 filings. In 2025, the company reported revenue of USD 2.4021 billion, up 19.9% year-on-year.
Industry observers note that the establishment of Huayao Semiconductor will further integrate Huahong’s technological, talent, and channel resources, expand its presence in both manufacturing and design, and support breakthroughs in key semiconductor technologies while advancing supply chain self-sufficiency.
As a whole, these developments reflect a broader shift in China’s semiconductor sector toward a more pragmatic and efficiency-driven growth model. By addressing gaps in critical nodes and deepening investment in specialty processes, the domestic ecosystem is steadily building comprehensive capabilities across logic, analog, and power semiconductors.
(Photo credit: Hua Hong)
