[News] Samhwa Paint Enters Semiconductor Materials with Melt Master Batch in Samsung AP Packaging

Riding the semiconductor surge, traditional industries are racing to pivot into the booming sector. South Korea’s paint giant, Samhwa Paint Industries, announced on March 6 that, in partnership with Samsung SDI, it has successfully developed high-performance MMB (Melt Master Batch), a key material powering next-generation semiconductor packaging.

Business Korea reports that mass production and delivery of the product have started. Samhwa Paint confirmed that the new MMB is already supplied to Samsung SDI and used in core AP packaging for newly launched mobile devices, with plans to expand its application to DRAM and NAND memory for AI servers in the future.

According to Samhwa Paint Industries, this achievement follows the two companies’ joint agreement last April to develop EMC (Epoxy Molding Compound), an epoxy material for semiconductor packaging. Business Korea reports that the collaboratively developed MMB acts as a semi-processed component in EMC fabrication, playing a crucial role in maintaining uniform quality and reliable performance in semiconductor packages.

Samhwa Paint explains that the two parties employed pre-reaction technology that directly synthesizes specialized resins and additives, enhancing chemical stability and ensuring uniform composition. This approach, which goes beyond the traditional dry blend method of merely mixing raw materials, effectively prevents semiconductor warpage while boosting moisture resistance and heat dissipation performance, the company says.

The company’s longstanding partnership with Samsung extends beyond semiconductor materials. For example, Samhwa Paint’s KSF 3211 Class 22 (Unexposed Waterproofing) has been applied to the floors of Samsung’s newly built Pyeongtaek facility.

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(Photo credit: Samhwa Paint Industries)