[News] Nanya Tech Reportedly Starts Custom AI Memory Trial, Progress Set to Show in H2 2026

Taiwanese DRAM maker Nanya Technology expects DRAM supply tightness to persist through 2028 and is ramping up expansion, while also revealing, for the first time, progress on its custom AI memory development. Citing company president Lee Pei-Ing, Commercial Times reports that some products have already entered trial production, with more tangible results expected in the second half of 2026.

The report notes that Nanya Tech’s AI memory technology, dubbed UltraWIO (Ultra Wide I/O), features a “super-wide input/output interface.” The architecture is reportedly designed for tight integration with customers’ AI engines, conceptually similar to how HBM operates with GPUs, dramatically increasing data channels and bandwidth to boost AI data access efficiency.

More Details for UltraWIO

Notably, Commercial Times explains that unlike standard JEDEC DRAM, UltraWIO is a customized architecture; the product reportedly leverages 3D stacking and advanced packaging to integrate with AI logic chips, delivering a memory solution with high bandwidth, high density, and low power consumption.

Commercial Times reports that Nanya Tech is teaming up with multiple logic IC makers to develop custom AI logic chips and memory architectures, reflecting the industry shift of AI inference from the cloud to the edge and the growing trend of decentralized computing. The company may leverage Wafer-on-Wafer (WoW) packaging, stacking the first DRAM layer in-house while partner firms handle the logic chip design, the report adds.

New Fab on Track

Meanwhile, TechNews reports that Nanya Technology plans to cap its 2026 capital expenditure at NT$52 billion. According to President Lee, equipment installation at the company’s new fab will begin in early 2027, with phased capacity expansions and the adoption of advanced 1B/1C/1D process nodes.

According to TechNews, Nanya Technology expects total investment in its new fab to exceed US$10 billion, with peak monthly wafer output reaching 45,000 units. The company plans to implement its self-developed advanced 10nm process, starting equipment installation in early 2027, with mass production slated for the second half of the year, the report adds.

Read more

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(Photo credit: Nanya Technology)