[News] Chinese Research Team Breaks Through Bottleneck in Power Semiconductor Packaging Materials

Recently, the New Energy Electrical Materials and Energy Storage Technology Cultivation Team from the School of Mechanical and Electrical Engineering at Xi’an University of Architecture and Technology proposed an innovative “molecular ordering design” strategy. Using this approach, the team developed a new epoxy encapsulation material that combines ultra-high thermal conductivity with exceptional insulation performance. The research was published in Advanced Functional Materials, offering a novel solution to the reliability challenges of power devices operating under extreme conditions.

As power semiconductor devices continue to become smaller and more powerful, their packaging materials face increasingly stringent requirements for managing both heat and electricity. Conventional epoxy resins struggle to achieve both high thermal conductivity and high insulation simultaneously, creating a key bottleneck in industrial advancement.

The research team ingeniously selected organic molecules as “templates” to induce a highly ordered molecular structure within the epoxy resin system. This ordered arrangement acts like a “highway” for heat transfer, significantly boosting thermal conductivity. Meanwhile, the dense molecular stacking and deep energy traps effectively “confine” high-energy electrons, allowing the material to maintain strong insulation even at elevated temperatures — remaining reliable even at 200 °C.

The team is now exploring the universality of this design strategy in various resin systems, aiming to advance its engineering applications in new energy systems and high-voltage power equipment.

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