[News] Huawei Appointed He Tingbo as Head of Senior Talent Compensation Division

He Tingbo, President of Huawei’s Semiconductor Business Unit, has recently been appointed as Head of the Senior Talent Compensation Division at Huawei. The internal announcement was officially released on July 1, with the appointment order signed by Huawei founder and CEO Ren Zhengfei on June 27.

Since joining Huawei in 1996, He Tingbo has held numerous key positions, including roles in chip development, research, architecture, and supply chain management. She previously served as President of HiSilicon and of the 2012 Laboratories, and currently serves as Chair of the Scientist Committee and Director of the ITMT (integrated technology management team).

Established in 2021, the Senior Talent Compensation Division is a secondary department under Huawei’s Human Resources unit. According to Huawei’s 2024 annual report, He’s appointment reflects the company’s growing demand for top-tier talent in the semiconductor field. Insiders note that business units have significant say in setting compensation for high-level talent, and He Tingbo’s new role is expected to further promote this process.

Notably, Huawei launched its “Genius Youth” recruitment program in 2019, with a view to attracting outstanding young talent globally. The program does not restrict applicants by university, major, or degree, but requires them to have demonstrated significant achievements in fields such as mathematics, physics, chemistry, computer science, or artificial intelligence, with a strong ambition to become industry technical pacesetters.

(Photo credit: Huawei)