[News] Deca and IBM Join Forces to Establish MFIT Manufacturing Base in North America

On May 22, Deca Technologies announced it has signed an agreement with IBM to bring Deca’s M-Series and Adaptive Patterning technologies into IBM’s advanced packaging facility in Bromont, Quebec, Canada. Under this agreement, IBM will establish a high-volume manufacturing line focused on Deca’s M-Series Fan-out Interposer Technology (MFIT). By combining IBM’s advanced packaging expertise with Deca’s proven technologies, the two companies aim to expand the global supply chain for high-performance chiplet integration and advanced computing systems.

This collaboration is part of IBM’s broader strategy to expand its advanced packaging capabilities. As one of the largest semiconductor packaging and testing sites in North America, IBM’s facility in Bromont has been at the forefront of packaging innovation for over 50 years. This facility’s investment in capability advancement recently have transformed it into a key hub for high-performance packaging and chiplet integration, supporting technologies critical to AI, high-performance computing (HPC), and data center applications—like MFIT.

Deca’s M-Series platform is the highest-volume fan-out packaging technology in the world, with more than 7 billion M-Series components shipped to date. Building on this mature foundation, MFIT integrates embedded bridge chips to enable ultimate integration between processors and memory, offering high-density, low-latency interconnects between chiplets.

As a full-silicon interposer, MFIT presents a cost-effective alternative with advantages in signal integrity, design flexibility, and scalability—meeting the growing demands of AI, HPC, and data center devices.

Scott Sikorski, Head of Chiplet and Advanced Packaging Business Development at IBM, stated that in the era of AI, advanced packaging and chiplet technologies are essential for delivering faster and more efficient computing solutions. Deca’s participation will help ensure that IBM’s Bromont facility stays ahead of innovation, advancing its commitment to helping clients accelerate time-to-market and deliver superior performance for AI and data-intensive applications.

Tim Olson, Founder and CEO of Deca, highlighted that IBM’s deep heritage in semiconductor innovation and advanced packaging makes it an ideal partner for scaling MFIT technology. He expressed great excitement about the collaboration, which will bring this advanced interposer technology into the North American ecosystem.

(Photo credit: IBM)