DRAM Market Bulletin - Sep. 9, 2026

Last Modified

2026-09-09

Update Frequency

Weekly

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PDF

RDIMM contract premium narrows on shifting demand, while spot market sees limited trades. Custom HBM (cHBM) optimizes AI chip area and performance via logical base dies, yet faces cooling, multi-sourcing, and high development cost hurdles, limiting early adoption to hyperscalers.

Key Highlights

Contract Market: RDIMM demand shifts to lower capacities, gradually narrowing the premium of high-capacity modules.
Spot Market: Demand remains sporadic; only select die items show modest price gains driven by actual orders.
cHBM Advantages: Transitioning base dies to logic processes frees up AI chip area while integrating controllers and unit logic for enhanced performance.
AI Key Player Strategy: NVIDIA launched NVHBM, moving controllers into the base die and boosting pin speed to optimize area and bandwidth.
Challenges & Constraints: Increased power/thermal risks, multi-sourcing difficulties due to high customization, and steep dev costs limit early adoption to key hyperscalers.

Market Update
TrendForce’s View
- Comparison of sHBM and cHBM

Comparison of sHBM and cHBM

Category: DRAM

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DRAM Market Bulletin - Sep. 9, 2026

Key Highlights