Foundry pricing trends tighten across mature nodes in 2026, with AI demand driving advanced-process overflow orders and reshaping competitive dynamics.
The need for power integrity in AI servers is extending from the board level directly into the package. This shift is driving a transition in capacitor technology, moving beyond a sole reliance on tra...
Taiwan foundries including TSMC, UMC, Vanguard, and PSMC are raising prices amid tight capacity, with increases set to extend into 2027.
Optical interconnects in AI data centers are shifting from legacy pluggable optics toward LPO, CPO and OCS. LPO streamlines the signal chain to improve power while keeping a pluggable model, CPO co‑pa...
Major foundries see rising utilization and pricing power, driven by front-loading demand and surging AI orders, lifting 2026 full-year outlook.
Taiwan foundries see strong 2Q26 rebound, led by TSMC's 3nm ramp and packaging, with peers eyeing HBM and interposer.
On April 23, 2026, TSMC unveiled at the 2026 North America Technology Symposium its Compact Universal Photonic Engine (COUPE) platform built on Co-Packaged Optics (CPO) technology, with mass productio...
As U.S. export controls extend from chips to AI infrastructure, the traditional optical interconnect industry is undergoing supply chain restructuring. While optical modules are not subject to blanket...
The semiconductor industry is undergoing a structural shift in 2026, with competition moving beyond process node scaling toward system-level architecture. On the technology front, 2nm gate-all-around...
AI demand reshapes chip supply; advanced nodes and packaging turn scarce, with early lockdowns now defining leadership.
Foundry shifts: Samsung Taylor starts, SMIC expands, HuaHong refines, Nexchip and CXMT ally, mature node prices rise.
Driven by AI, next-generation advanced NAND has become the mainstream. As traditional vertical stacking encounters physical limitations and performance degradation, the industry's focus is shifti...
In AI inference, MoE architectures and long-context processing have sharply increased memory-capacity requirements for model weights and KV cache, shifting the bottleneck from insufficient compute to...
With the generative AI market expanding at a CAGR of over 35%, data throughput for a single large language model (LLM) training task has reached the exabyte (EB) level. As transmission speeds evolve t...
For the current year of 2026, TSMC plans to establish a trial production line CoPoS through its subsidiary, VisEra, with trial production scheduled for 2027. Consequently, this year will be a critical...
