Advanced Packaging

Foundry Market Bulletin - Oct. 19, 2026 | TrendForce

Foundry Market Bulletin - Oct. 19, 2026

Oct 19, 2026 | PDF

Samsung speeds 8-inch cuts, plans 2027 hikes; AI demand lifts mature nodes as SMIC, Nexchip, HuaHong raise prices, expand.

Process Control Paradigm Shift: AI Drives Structural Growth in Demand for Metrology and Inspection | TrendForce

Process Control Paradigm Shift: AI Drives Structural Growth in Demand for Metrology and Inspection

Oct 13, 2026 | PDF

AI and advanced nodes are driving a paradigm shift in process control. Although GAA, HBM, and advanced packaging follow different paths, all share one logic: testing costs far less than failure. This...

CSP ASICs Rise as Google TPU Eyes EMIB Packaging | TrendForce

CSP ASICs Rise as Google TPU Eyes EMIB Packaging

Oct 13, 2026 | PDF

Inference demand drives CSP ASIC growth past GPUs; Google's next TPU adopts EMIB-T, with substrate yield key to cost.

Foundry Market Bulletin - Oct. 5, 2026 | TrendForce

Foundry Market Bulletin - Oct. 5, 2026

Oct 05, 2026 | PDF

Tight 8-inch supply fuels foundry price hikes, as TSMC and peers pivot mature capacity to advanced packaging and SiPh.

CIOE 2026 Exhibit Report- Near-Eye Display | TrendForce

CIOE 2026 Exhibit Report- Near-Eye Display

Sep 22, 2026 | PDF

This exhibition report focuses on two key components of near-eye displays—light engines and waveguides. By tracking the product development and capacity expansion of major suppliers, the report provid...

Foundry Market Bulletin - Sep. 21, 2026 | TrendForce

Foundry Market Bulletin - Sep. 21, 2026

Sep 21, 2026 | PDF

Non-TSMC foundries head into 2027 with higher utilization, price hikes, and sustained strong revenue growth.

2026 Micro LED Display and Non-Display Application Market Analysis | TrendForce

2026 Micro LED Display and Non-Display Application Market Analysis

Sep 15, 2026 | PDF

This report uncovers the overall Micro LED market size and provides an in-depth analysis of distinct Micro LED applications and manufacturer dynamics, spanning various glass-based display applications...

CSP ASIC Demand Fuels Advanced Packaging Evolution | TrendForce

CSP ASIC Demand Fuels Advanced Packaging Evolution

Sep 11, 2026 | PDF

CSPs scale ASICs alongside GPUs, lifting packaging demand as CoWoS-L leads while EMIB-T and FOPLP emerge as new options.

2026 3D IC Outlook: SoIC Ramp-Up, Rise of STCO | TrendForce

2026 3D IC Outlook: SoIC Ramp-Up, Rise of STCO

Sep 04, 2026 | PDF

In the OCP APAC Summit held in August 2026, suppliers including TSMC, ASE, and AMAT all highlighted the future trends of 3D IC. In September, during SEMICON, the 3DIC Advanced Manufacturing Alliance (...

Foundry Market Bulletin - Aug. 17, 2026 | TrendForce

Foundry Market Bulletin - Aug. 17, 2026

Aug 17, 2026 | PDF

2Q26 foundry revenue rose broadly; overseas, China fab expansion should keep capacity tight, lifting full-year momentum.

Foundry Market Bulletin - Aug. 3, 2026 | TrendForce

Foundry Market Bulletin - Aug. 3, 2026

Aug 03, 2026 | PDF

TSMC, UMC, Vanguard and PSMC posted higher 2Q26 revenue on price hikes and strong demand, with capex broadly raised.

Foundry Market Bulletin - Jul. 20, 2026 | TrendForce

Foundry Market Bulletin - Jul. 20, 2026

Jul 20, 2026 | PDF

AI demand reshapes foundry priorities: photonics, packaging gains, tight mature nodes, rising power investment.

Foundry Market Bulletin - Jul. 6, 2026 | TrendForce

Foundry Market Bulletin - Jul. 6, 2026

Jul 06, 2026 | PDF

Major foundries push fab buildouts, transfer orders, price talks, and specialty processes to boost capacity.

Si-Cap Embedded Packaging Rises for AI: Technical Routes and Competitive Landscape | TrendForce

Si-Cap Embedded Packaging Rises for AI: Technical Routes and Competitive Landscape

Jul 01, 2026 | PDF

As AI chips require increasingly stable power delivery, Si‑Cap (silicon capacitors) and their embedded/integrated packaging have become an important technological development direction, and key compan...

2026 China AI Chip Industry: Opportunities and Challenges for Domestic Substitution Amid Geopolitical Risk | TrendForce

2026 China AI Chip Industry: Opportunities and Challenges for Domestic Substitution Amid Geopolitical Risk

Jun 26, 2026 | PDF

The AI industry entered a critical transition period in 2025, marked by the rapid expansion of LLMs and the large-scale commercialization of AI applications. For China’s semiconductor industry, this r...

Get in touch with us


Get in touch with us