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Rising Memory and CPU Prices Could Push Mainstream Notebook Prices Up by Nearly 40%, Says TrendForce

10 March 2026

For a mainstream notebook with an MSRP of US$900, surging memory prices alone could raise retail prices by more than 30%; combined with CPU price increases, the total price hike could approach 40%. If memory and CPU prices rise simultaneously, their combined share of notebook BOM costs could climb to 58%. CPU supply volatility is also emerging, with shortages beginning to affect entry-level platforms across multiple brands.

Global Smartphone Production Reaches 1.25 Billion Units in 2025, with Apple and Samsung Tied for Top Spot, Says TrendForce

9 March 2026

Global smartphone production reached 337 million units in 4Q25, rising 2.7% QoQ, and was supported by strong shipments of Apple’s new iPhone lineup, according to TrendForce’s latest insights into the smartphone industry. For the full year, both Apple and Samsung each produced nearly 240 million units, tying for the top position in global smartphone production.

Supply Chain Control Enables Apple to Launch Lower-Priced Notebooks Amid Industry Downturn to Fill Pricing Gap, Says TrendForce

5 March 2026

MacBook Neo signals Apple’s formal expansion into lower price tiers, cultivating future brand loyalty earlier. Pricing aligns with mainstream Windows notebooks, strengthening competitiveness in education procurement markets. Apple’s superior supply chain control allows it to introduce a lower-priced device despite industry headwinds.

Memory Price Surge Disrupts Supply Chain; Global Smartphone Panel Shipments Forecast to Fall 7.3% in 2026, Says TrendForce

5 March 2026

TrendForce’s latest research on smartphone panels reveals that shortages and rising memory prices—one of the most costly components in smartphones—are reshaping brand shipment strategies for 2026 and weakening panel demand.

Power Consumption Reduced to 5% of Copper Cables as Micro LED CPOs Open New Path for Data Center Interconnects, Says TrendForce

4 March 2026

The rapid rise of generative AI is driving continuous growth in demand for high-speed data transmission in data centers. Copper cable solutions, traditionally used for short-distance intra-rack interconnects, are increasingly facing challenges in both transmission density and energy efficiency.


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