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Global NEV Sales to Grow 14% in 2026; USMCA Renegotiation Poses Critical Risk to Auto Industry, Says TrendForce

2 March 2026

TrendForce’s latest findings have revealed that global sales of NEVs, including BEVs, PHEVs, and FCVs, reached 20.53 million units in 2025, up 26% YoY.

Price Rally Drives 4Q25 DRAM Revenue Up 29.4%; Samsung Regains No. 1 Market Share, Says TrendForce

26 February 2026

TrendForce’s latest findings reveal that the expansion of AI applications from LLM training to inference has prompted CSPs to broaden data center build-outs beyond AI servers to include general-purpose servers.

Combined CapEx of Top Eight CSPs to Exceed $710 Billion in 2026; Google Leads ASIC Deployment with TPUs, Says TrendForce

25 February 2026

Global CSPs are accelerating investment in AI servers and infrastructure to support expanding AI deployment and upgrades, according to TrendForce’s latest findings on the AI server market. Combined capital expenditures by the world’s eight leading CSPs—Google, AWS, Meta, Microsoft, Oracle, Tencent, Alibaba, and Baidu— are projected to exceed $710 billion in 2026, representing approximately 61% YoY growth.

Rising Material and Labor Costs to Lift 1Q26 UV LED Prices by 5% QoQ; Full-Year Market Size to Surpass US$200 Million, Says TrendForce

24 February 2026

TrendForce’s latest analysis of the UV LED market reveals that increasing precious metal prices, rising raw material costs, and growing labor expenses are providing price support for UV LEDs in the first quarter of 2026. In particular, customized products are expected to see quarter-on-quarter price gains of up to 5%.

HBM4 Validation Expected in 2Q26; Three Major Suppliers Poised to Shape NVIDIA Supply Landscape, Says TrendForce

13 February 2026

TrendForce’s latest analysis of the HBM industry reveals that as the ongoing expansion of AI infrastructure continues to fuel GPU demand, NVIDIA’s upcoming Rubin platform is expected to become a major catalyst for HBM4 adoption once mass production begins. The three leading memory suppliers—Samsung, SK hynix, and Micron—are now in the final stages of HBM4 validation, with completion anticipated by 2Q26.


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