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Global EV Traction Inverter Installations Reach New High in 4Q25; High-Voltage Platform Adoption Continues to Rise, Says TrendForce

16 March 2026

TrendForce’s latest research on EV traction inverters reveals that strong growth in BEV sales in 4Q25 drove global traction inverter installations to around 9.65 million units, marking the highest level in nearly two years. The result reflects the continued shift toward vehicle electrification and the increasing adoption of electric drive systems per vehicle.

New 8.6-Gen Fabs Accelerate Capacity Shift, Putting Smaller LCD Lines Under Pressure, Says TrendForce

13 March 2026

According to TrendForce’s latest research on the display panel industry, technological upgrades, rising production cost pressure, and the gradual ramp-up of new 8.6-gen fabs are reshaping the LCD manufacturing landscape.

Global Top Five Enterprise SSD Vendors Post Over 50% QoQ Revenue Growth in 4Q25, with SK Group Leading Growth, Says TrendForce

13 March 2026

The widespread adoption of AI inference workloads in 4Q25 significantly raised requirements for data storage systems, according to TrendForce’s latest findings on the enterprise SSD market. Meanwhile, enterprises accelerated upgrades to their general-purpose servers, while shortages in HDD supply pushed some demand toward SSD solutions. These factors together drove combined revenue for the world’s top five enterprise SSD vendors up 51.7% QoQ to more than US$9.9 billion.

AI Demand Drives 4Q25 Global Top 10 Foundries Revenue Up 2.6% QoQ; Samsung Gains Share and Tower Moves Up in Rankings, Says TrendForce

12 March 2026

TrendForce’s latest research on the semiconductor foundry industry reveals that advanced-node demand remained strong in 4Q25, driven by the tight supply of AI server GPUs and Google TPUs. Furthermore, the launch of new smartphones boosted wafer orders for mobile application processors (APs), supporting solid shipment performance.

NVIDIA Compute Architecture Paves the Way for Scale-Up Optical Interconnects; CPO Penetration in AI Data Centers Expected to Rise Steadily, Says TrendForce

11 March 2026

NVIDIA’s next-generation AI compute rack architecture indicates that future GPU designs will increasingly prioritize higher chip-to-chip interconnect density and faster data transmission, according to TrendForce’s latest research on the high-speed interconnect market. Intra-rack chip interconnects (scale-up) and large-scale interconnects across racks (scale-out) will become central considerations in data center design as AI clusters continue to scale.


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