According to a report from wccftech, leading semiconductor foundry TSMC is preparing to increase the prices of its 3nm and 5nm processes. Reportedly, this move is said to maintain its long-term gross profit margin of 53% and secure its leadership position in the semiconductor foundry market.

The report notes that considering the high demand for AI, along with orders for consumer products from IC design companies like Apple and Qualcomm, TSMC’s production capacity remains tight.

Therefore, TSMC is reportedly planning to increase the prices of its advanced processes, such as 3nm and 5nm, by 8%, thereby ensuring stable long-term profit margins. Notably, a previous report from Commercial Times have cited sources, indicating that NVIDIA CEO Jensen Huang once agreed that TSMC’s pricing is too low and will support its price increase actions.

Although the price increase has been rumored for some time, the sources cited by wccftech indicate that TSMC may implement the hike soon.

Currently, TSMC’s 3nm and 5nm process utilization rates are at 100%, indicating complete market dominance in these processes. This already allows TSMC to profit significantly, and the price increase will further benefit their operations.

In addition to advanced processes, there are rumors that TSMC is also raising the price of CoWoS packaging due to the massive demand for AI chips from AMD and NVIDIA. Although specific figures have not been disclosed, TSMC’s rapid expansion of its CoWoS production lines makes the price increase likely.

It’s previously estimated by sources cited in MoneyDJ’s report that TSMC’s CoWoS capacity remains in short supply, at 35,000 to 40,000 wafers per month this year. With the additional outsourced capacity, next year’s production could reach over 65,000 wafers per month, or possibly higher.

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• [News] CoWoS Booming, TSMC Price Hikes Reportedly Imminent
• [News] NVIDIA CEO Jensen Huang Supports C.C. Wei’s Theory and Backs for TSMC to Increase Price

(Photo credit: TSMC)

After TSMC released its Q3 guidance at the earnings call last week, eyeing for at least a 7.5% revenue growth, it is now said that the foundry giant has got another major boost for the following quarters. According to a report from Technews, citing Chinese media outlet ijiwei, the company is said to receive an increase in orders for Super Hot Run (SHR) from Chinese clients, and they are willing to pay up to 40% extra.

Sources cited by the reports indicated these rush orders may come from Chinese tech heavyweights, including Bitmain, Alibaba’s T-Head, and Sanechips, which are urgently stockpiling chips due to escalating tensions between the U.S. and China.

In fact, according to information from TSMC’s previous earnings conference, sales generated from orders by TSMC’s Chinese clients in the second quarter of 2024 increased from 9% of total wafer revenue in the previous quarter to 16%.

The reports stated that Chinese chip manufacturers are accelerating their pace for placing orders in response to the uncertainties arising from the upcoming U.S. presidential election and its impact on U.S.-China relations. This move is expected to provide support for TSMC’s revenue and gross margins afterwards, which may help its performance in the third quarter and the full year to exceed forecasts.

TSMC raised its projected revenue growth for 2024 to over 25% last week, thanks to the robust demand for high-end smartphones and artificial intelligence (AI) devices, which is expected to boost the use of advanced 3nm and 5nm chips.

Previous reports have indicated that TSMC is facing overwhelming demand for its 3nm technology, with major clients like Apple and NVIDIA eagerly booking for more capacity, while orders are expected to be filled through 2026. Now it seems that the demand from China has also been heating up.

Reportedly, TSMC is planning to raise its 3nm prices by over 5%, and advanced packaging prices are anticipated to increase by approximately 10% to 20% next year.

To meet this robust demand, TSMC plans to increase monthly production capacity to 130,000 wafers for its 3nm process and 160,000 to 170,000 wafers for its 4/5nm processes.

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• [News] TSMC Projects 7.5% Q3 Revenue Growth, Adjusts Full-Year CAPEX Range
• [News] Chinese Firms Stockpile Chips Amid Geopolitics; TSMC Sees Rush Orders

(Photo credit: TSMC)

Chinese tech giant Huawei, which plans to launch its Mate 70 Series in the fourth quarter, is reportedly to feature the latest Kirin 9100 processor in these models. Though there were rumors indicating that the chip will be manufactured with SMIC’s 5nm node, according to a report by Wccftech, the next Kirin SoC for the Mate 70 Series will still be limited to SMIC’s 7nm process.

Kirin 9100’s predecessors, the Kirin 9000S and the Kirin 9010, have been mass-produced using SMIC’s 7nm (N+2) technology, the report notes. As market speculations previously indicated that Huawei might use 5nm in its next Kirin SoC, there seems to be a twist in Huawei’s plans.

According to Wccftech, the next Kirin SoC for the Mate 70 series will likely be mass-produced using SMIC’s N+3 process, which offers higher density compared to the N+2 variant. The move means that instead of transitioning to SMIC’s 5nm, Huawei’s latest Kirin SoC may choose to stay with 7nm.

It is worth noting that even under the U.S. export control, SMIC is said to successfully produce 5nm chips using DUV lithography instead of EUV, which is typically required for 5nm production. However, as the high cost and low yield of DUV make it a challenging feat for most manufacturers, Huawei’s decision may be practical.

As previously reported by the Financial Times, industry sources have indicated that SMIC’s prices for 5nm and 7nm processes are 40% to 50% higher than TSMC’s, while the yield less than one-third of TSMC’s. Later, it was estimated that SMIC’s 5nm chip prices would be up to 50 percent more expensive than TSMC’s on the same lithography, meaning that Huawei would face a tough time selling its Mate 70 series to consumers with a decent margin if it attempts to absorb a majority of those component costs.

Therefore, Wccftech now states that the Kirin 9100 might be fabricated using the 7nm process. By employing the N+3 node, it could achieve a higher density than the Kirin 9010 and the Kirin 9000S, which are manufactured by the N+2 node. This improvement means that the Kirin 9100 will have a higher transistor count, leading to better performance per watt and improved power efficiency.

Alongside the new chipset for the Mate 70 family, Huawei is rumored to be testing the same N+3 technology for its ARM-based hardware, the report notes.

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• [News] Huawei Reportedly to Launch Kirin 9100 with Superior Performance to Snapdragon 8 Gen 2
• [News] SMIC Reportedly to Manufacture 5nm Chips for Huawei Without EUV Machinery

(Photo credit: Hisilison)

On the 15th, Microsoft introducing its first in-house AI chip, “Maia.” This move signifies the entry of the world’s second-largest cloud service provider (CSP) into the domain of self-developed AI chips. Concurrently, Microsoft introduced the cloud computing processor “Cobalt,” set to be deployed alongside Maia in selected Microsoft data centers early next year. Both cutting-edge chips are produced using TSMC’s advanced 5nm process, as reported by UDN News.

Amidst the global AI fervor, the trend of CSPs developing their own AI chips has gained momentum. Key players like Amazon, Google, and Meta have already ventured into this territory. Microsoft, positioned as the second-largest CSP globally, joined the league on the 15th, unveiling its inaugural self-developed AI chip, Maia, at the annual Ignite developer conference.

These AI chips developed by CSPs are not intended for external sale; rather, they are exclusively reserved for in-house use. However, given the commanding presence of the top four CSPs in the global market, a significant business opportunity unfolds. Market analysts anticipate that, with the exception of Google—aligned with Samsung for chip production—other major CSPs will likely turn to TSMC for the production of their AI self-developed chips.

TSMC maintains its consistent policy of not commenting on specific customer products and order details.

TSMC’s recent earnings call disclosed that 5nm process shipments constituted 37% of Q3 shipments this year, making the most substantial contribution. Having first 5nm plant mass production in 2020, TSMC has introduced various technologies such as N4, N4P, N4X, and N5A in recent years, continually reinforcing its 5nm family capabilities.

Maia is tailored for processing extensive language models. According to Microsoft, it initially serves the company’s services such as $30 per month AI assistant, “Copilot,” which offers Azure cloud customers a customizable alternative to Nvidia chips.

Borkar, Corporate VP, Azure Hardware Systems & Infrastructure at Microsoft, revealed that Microsoft has been testing the Maia chip in Bing search engine and Office AI products. Notably, Microsoft has been relying on Nvidia chips for training GPT models in collaboration with OpenAI, and Maia is currently undergoing testing.

Gulia, Executive VP of Microsoft Cloud and AI Group, emphasized that starting next year, Microsoft customers using Bing, Microsoft 365, and Azure OpenAI services will witness the performance capabilities of Maia.

While actively advancing its in-house AI chip development, Microsoft underscores its commitment to offering cloud services to Azure customers utilizing the latest flagship chips from Nvidia and AMD, sustaining existing collaborations.

Regarding the cloud computing processor Cobalt, adopting the Arm architecture with 128 core chip, it boasts capabilities comparable to Intel and AMD. Developed with chip designs from devices like smartphones for enhanced energy efficiency, Cobalt aims to challenge major cloud competitors, including Amazon.
(Image: Microsoft)