TrendForce offers you a complete analysis on DRAM industry supply/demand sufficiency, cost analysis and price forecast.
Rising memory prices curb next year's smartphone output, eased by pulled and downgraded parts; server demand props up quotes, but ample consumer inventory leaves trading thin.
TrendForce offers you a complete analysis on NAND Flash industry supply/demand sufficiency, cost analysis and price forecast.
This report will show surveys of the mainstream smartphone panel sizes' quote prices, which will be categorized by including different resolutions, specifications, modules or product formations such as cell or glass. Prices will be also presented by their high-, low- and average-price levels for customers' references. Besides, smartphone panel price forecast is newly added, it could keep clients updated on smartphone panel price trend in the year to come.
Agentic AI elevates memory as LPDRAM shifts to servers, squeezing smartphones and widening the gap for smaller brands.
Quarterly Smartphone Market Status Update tracks on global smartphones market trend. Through the discussion of market scale, trend of panel spec, cost and price changes as well as the movement of capacity and utilization of smartphones, TrendForce keeps its clients up to date to the smartphone market’s potential development.
AI servers continue to crowd out DRAM capacity, driving a supply-demand imbalance and price hikes that will persist into 2027. Impacted by skyrocketing component costs, global smartphone shipments are expected to contract further. To manage cost pressures, brands are adjusting pricing and production strategies, while entry-level markets may adopt salvaged and downgraded materials to sustain operations.
Surging memory prices have triggered early purchasing, driving a short-term recovery in smartphone production this year; however, this pull-in effect will exacerbate market deterioration next year. Constrained by a high base and rising buyer inventory levels, the growth rate of Mobile DRAM contract prices is narrowing in the third quarter. As original manufacturers shift production capacity toward server DRAM and high-bandwidth memory (HBM), prices are projected to enter a period of high-level consolidation by year-end, with supply remaining tight into next year.
New CEO Ternus leads Apple's first foldable launch; modest specs upgrade amid surging memory costs puts pricing and AI delivery at center stage.
Rising memory costs triggered premature purchases as consumers sought to beat price hikes, driving a short-term rebound in smartphone production and prompting TrendForce to revise its full-year output forecast upward. However, this momentum reflects front-loaded demand rather than a genuine market recovery. As persistent cost pressures trickle down to end-user pricing, entry-level models are set to disappear, leaving the market vulnerable to structural contraction risks ahead.
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