AI chipmakers are adopting custom HBM as base dies move to advanced logic nodes, strengthening TSMC's role in the HBM supply chain.
NVIDIA shipments stay Blackwell-led as Rubin's ramp slips into next year on HBM4 snags, keeping HBM the key bottleneck.
AI chip makers weigh downgrading HBM capacity, hitting capacity for KV cache, lifting offload memory demand, as 8hi stays mainstream.
CSPs scale ASICs alongside GPUs, lifting packaging demand as CoWoS-L leads while EMIB-T and FOPLP emerge as new options.
HBM supply expands as shares shift; 2026 is a pricing pause, 2027 brings a sharp ASP surge as HBM4 rises.
HBM grows strongly in 2026 as CSP/ASIC demand lifts HBM3e prices; SK hynix leads, Samsung rebounds, Micron expands TSV.
Driven by AI, next-generation advanced NAND has become the mainstream. As traditional vertical stacking encounters physical limitations and performance degradation, the industry's focus is shifti...
DRAM industry will focus on HBM capacity expansion, with Chinese suppliers limited by equipment restrictions; major players like Samsung, SK hynix, and Micron emphasize tech migration and AI applicati...
In 2026, the HBM market continues to grow, with SK hynix maintaining its lead and Samsung recovering significantly via HBM3e and HBM4 contributions. Micron also expands aggressively. While HBM3e domin...
Major suppliers are expanding HBM capacity, with 2025 shipments revised upward. SK hynix leads with 150K TSV capacity, while Micron ramps up its Taiwan facilities. By 2026, all three will begin HBM4 m...
The report highlights major manufacturers' HBM capacity strategies, facility expansions, and market trends driven by AI, offering strategic insights for the industry.
Glass substrates are emerging as a highly promising solution in advanced semiconductor packaging with recent breakthroughs in Through-Glass Via (TGV) technology. They are poised to drive innovation in...
Despite concerns about a downward revision in AI-related demand, SK hynix is projected to experience higher demand for its products and achieve yield improvements...
Regarding the production of HBM products, SK hynix continues to dominate the market. SK hynix plans to double its production capacity by 2025...
TrendForce has revised its 2025 DRAM price forecast downward, projecting price declines in the first half of next year, with DDR4 and LPDDR4X experiencing steeper drops. Key factors contributing to th...
