Agentic AI and inference reshape workloads, lifting server CPU demand. Shipments surge as CSP in-house Arm CPUs erode x86 share.
Inference demand drives CSP ASIC growth past GPUs; Google's next TPU adopts EMIB-T, with substrate yield key to cost.
Hyperscaler Capex keeps rising on price hikes and shortages; pricier AI racks drive server value growth over volume.
US hyperscalers keep expanding, but midterm-driven backlash may raise costs and delay permits for later-stage projects.
AI chip and server growth accelerates in 2027 on rack-scale systems and ASICs, while HBM and CoWoS supply stays tight.
TrendForce combines its expertise in the Foundry/Server industry and leverages it with the supply chain to accurately estimate AI chip shipments, AI Server application ratios, AI major suppliers&a...
NVIDIA shipments stay Blackwell-led as Rubin's ramp slips into next year on HBM4 snags, keeping HBM the key bottleneck.
AI chip makers weigh downgrading HBM capacity, hitting capacity for KV cache, lifting offload memory demand, as 8hi stays mainstream.
CSPs scale ASICs alongside GPUs, lifting packaging demand as CoWoS-L leads while EMIB-T and FOPLP emerge as new options.
Robust CSP capex drives AI server growth, led by NVIDIA racks, as ASICs, China's supply chain, and liquid cooling advance.
AI chip demand surges in 2026, with high-end GPUs dominating. NVIDIA leads, ASICs gain share, liquid cooling expands, and AI server value hits record highs.
The AI industry entered a critical transition period in 2025, marked by the rapid expansion of LLMs and the large-scale commercialization of AI applications. For China’s semiconductor industry, this r...
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Taiwan foundries see strong 2Q26 rebound, led by TSMC's 3nm ramp and packaging, with peers eyeing HBM and interposer.
AI server market expands robustly in 2026 amid hyperscaler capex, NVIDIA racks, and tight HBM-CoWoS supply chains.
