Daily Archives: 2026-03-03

[News] SK hynix Reportedly Explores New HBM4 Packaging, Boosting Performance via Tight DRAM Gaps

In the race for next-generation HBM, packaging has emerged as a new focal point. According to ZDNet, industry sources say SK hynix is advancing a packaging overhaul aimed at enhancing stability and performance, with the technology currently under validation. If …

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[News] SKC Reportedly Channels Over Half of ₩1T Capital Increase Into Absolics to Fast-Track Glass Substrates

As traditional materials approach their physical limits, glass substrates are coming to the forefront of next-generation chip packaging. According to Global Economic, SKC recently announced plans to allocate more than ₩600 billion—over half of its ₩1 trillion capital increase—to its …

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[News] Delay at Samsung’s Taylor Reportedly Slips Mass Production to 2027, Raising Concerns for Tesla

As Samsung accelerates fab approvals and equipment installations, questions are emerging about the pace of mass production at the Taylor plant. Korea JoongAng Daily reports that the start of full-scale production at Samsung’s Texas facility is now expected to slip …

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[News] Israel Unrest Disrupts Tower; Orders Reportedly Shift to Vanguard, PSMC, Lifting Mature-Node Pricing

As Israel enters a state of emergency, shipments from Israel-based foundries have reportedly been disrupted, prompting global companies to shift orders. According to Economic Daily News, Israel’s largest foundry and a top-ten global player, Tower Semiconductor, has faced shipment constraints, …

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[News] Intel Unveils Xeon 6+ Clearwater Forest at MWC with 18A Chiplet Design and Foveros Direct 3D

Just weeks after unveiling Panther Lake at CES in January, Intel returned to the spotlight at MWC 2026 with the Xeon 6+ “Clearwater Forest,” showcasing the progress of 18A. According to TechPowerUp, the processor features one of Intel‘s most advanced …

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