Applied Materials is strengthening its position in advanced chip packaging as demand for AI-related semiconductor technologies continues to grow. According to Reuters, the U.S. semiconductor equipment maker plans to increase its stake in Dutch company BE Semiconductor Industries (BESI) from 9% to ap...

Apple’s first foldable smartphone, the iPhone Duo, is facing quality concerns following reports of display damage near the hinge. According to ZDNet, citing MacRumors, persistent hinge problems during development prompted changes to its primary and secondary suppliers. Industry sources suggest App...

As a major HBM customer, NVIDIA is stirring fresh debate with two reported shifts in its memory strategy. According to ZDNet, Samsung and SK hynix are preparing to ship 8-Hi HBM4 for Rubin Ultra in 2Q27, marking a departure from the original 12-Hi HBM4E plan. Separately, Wccftech reports that NVIDIA...

As increasingly large AI accelerators strain advanced packaging capacity, TSMC’s CoWoS supply remains tight. According to supply chain sources cited by Commercial Times, the foundry giant is reportedly weighing price hikes of up to 20%, with some packaging lead times already stretching. The pri...

Micro LED optical interconnect is gaining momentum in 2026. Two recent developments highlight growing interest in the emerging field: U.S. AR glasses maker Vuzix unveiled an optical interconnect evaluation platform based on its waveguide technology at the OCP Global Summit; Chinese Micro LED...