Author Archives: TrendForce

[News] UMC Reportedly Eyes Southern Taiwan Facility for Advanced Packaging Expansion Beyond Singapore

Taiwan’s second-largest foundry, UMC, is stepping up its efforts in advanced packaging. According to a report from Commercial Times, sources say the company is considering acquiring the facility of TFT-LCD panel maker HannStar in the Southern Taiwan Science Park, which could be …

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[News] SK hynix Reportedly Leads Custom HBM4E Push with NVIDIA, Microsoft; Samsung Trails with HBM4

As Samsung pushes to accelerate 1c DRAM development and regain ground in the HBM4 race, current leader SK hynix is pulling ahead with custom HBM solutions for tech giants. According to the Korea Economic Daily, its first customized HBM—likely HBM4E—is …

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[News] Trump’s AI Czar: China at Most Two Years Behind U.S. in Chip Design

According to Bloomberg, White House crypto and AI czar David Sacks states that China is, at most, two years behind the U.S. in semiconductor design and has become increasingly adept at circumventing U.S. export controls. Sacks warns that the U.S. …

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[News] Samsung’s 1c DRAM Yields Reportedly Reach up to 70%, Paving Way for HBM4 by Year-end

With hopes of turning the tide in the HBM4 era resting on its progress in 1c DRAM, Samsung has reportedly made a major leap in yield rates. According to Sedaily, the company recently achieved yields of 50–70% in tests for …

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[News] Audi Unveils New Q3, Featuring Micro-LED Headlights for the First Time

According to a report from Mezha Media, the latest Audi Q3 crossover stands out from other models in the lineup as the first to feature micro-LED headlights. This technology uses a DMD module—composed of tiny mirror elements—for highly flexible light …

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