Daily Archives: 2026-03-03

[News] Samsung Reportedly Targets HBM4E Power Bottleneck with Design Overhaul, Cuts Defects 97%

Posted on 2026-03-03 by TrendForce

In the HBM industry, performance metrics such as speed and stack count typically draw the most attention, but power efficiency is emerging as an equally critical factor. According to Hankyung, as the industry transitions to HBM4E, Samsung is proposing a …

Continue reading →
Posted in DRAM, Semiconductors | Tagged , | Leave a comment

[News] China’s Smartphone Market Divides: Honor, Vivo at MWC vs Reported Memory-Driven Price Hikes This Week

Posted on 2026-03-03 by TrendForce

China’s smartphone market is revealing two starkly contrasting realities. At MWC Barcelona, running from March 2 to 5, major brands are unveiling AI-powered flagships, foldables, and even robot phones, showcasing cutting-edge innovations to capture consumer attention. Meanwhile, smaller makers are …

Continue reading →
Posted in Consumer Electronics, DRAM, Semiconductors, Smartphones | Tagged , , | Leave a comment