Navigating the AI Server Market

Driven by our unwavering commitment to excellence, TrendForce leads AI server analysis, dissecting the market through the lens of supply and demand. Our comprehensive investigation spans critical components like AI chips, HBM, power systems, and cutting-edge cooling solutions. Partner with us in shaping the future of AI technology.

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Overview

AI server

The AI server market is set for unprecedented growth in 2023-2024, driven by substantial investments from CSP and industry players, with shipments projected to exceed 1.2 million units in 2023, boasting a remarkable 38% annual growth rate. Looking to 2024 and beyond, heightened interest across various sectors will fuel dedicated efforts in AI model development and software services, while also propelling the growth of edge computing AI servers using mid-range GPUs and FPGAs, with an anticipated average annual growth rate of over 20% from 2023 to 2026.

Key Takeaway

uptrend

Amidst the boom of Generative AI, memory manufacturers are actively expanding production. The estimated annual growth rate of HBM bits supply in 2024 is 105%.

uptrend

Major cloud providers are actively building AI servers, accelerating the demand for AI chips and HBM. It is estimated that advanced packaging capacity will increase by 30-40% by 2024.

tietrend

The global server unit shipment volume in 2024 is still limited, with an estimated annual growth rate of only 2.3%

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As Diverse Applications Drive Market Growth of HBM, 2.5D Packaging Plays a Critical Role in Development of This Memory Solution

As Diverse Applications Drive Market Growth of HBM, 2.5D Packaging Plays a Critical Role in Development of This Memory Solution

The load of cloud computing will continue to elevate under the advancement of diversified applications, where restricted growth of performance in DDR SDRAM could encumber the performance of computing systems, which allows HBM to further exert its abilities. This report probes into the demand background and development tendencies of HBM, and focuses on the 2.5D packaging technology that integrates HBM.
Hybrid Bonding Technology Portrays Essential Role as Advanced Packaging Continues to Evolve

Hybrid Bonding Technology Portrays Essential Role as Advanced Packaging Continues to Evolve

The utilization of chiplets paired with 2.5D and 3D advanced packaging technology is bound to become one of the inevitable development trends of high-end chips in order to allow a continuous elevation of computing performance for chips according to the Moore’s Law. With that being said, the existing micro-bump bonding technology that could impede high-end chips from fully exerting their performance would have to be replaced by hybrid bonding. This report analyzes development trends of chiplet design and advanced packaging technology on the one hand, and probes into the necessity and development momentum of the hybrid bonding technology on future development of high-end chips on the other hand.
CSPs and HPC AI Applications to Play Vital Roles in Shaping AI Server Market during 2023~2024

CSPs and HPC AI Applications to Play Vital Roles in Shaping AI Server Market during 2023~2024

The market for AI servers can be segmented into CSPs, supercomputer (HPC) projects, and server brands. Major CSPs represent the largest group of customers, accounting for a growing share of AI server shipments during 2022-2026. By 2026, major CSPs are forecasted to account for 76% of the annual total shipments of high-end AI servers...
2H23 Dynamics of AI Server Market Forecast

2H23 Dynamics of AI Server Market Forecast

Dynamics of AI Server Market/HBM Market Outlook/Key Takeaways
HBM Sees Marginal Shifts in Market Shares for 2023 and 2024 amidst Successive Demand Increment among End Clients

HBM Sees Marginal Shifts in Market Shares for 2023 and 2024 amidst Successive Demand Increment among End Clients

As indicated by the survey of global market intelligence firm TrendForce, Samsung has simultaneously acquired a large extent of demand from its strategic partners Google and AWS...
Opportunities in Markets for PSUs and Liquid Cooling Solutions Generated by Rapid Growth of AI Servers

Opportunities in Markets for PSUs and Liquid Cooling Solutions Generated by Rapid Growth of AI Servers

1. Projection on Development of AI Server Market 2. Comparison of AI Servers and Convention Servers in Terms of Energy Consumption 3. Development Trends in Higher-Spec PSUs and Liquid Cooling Solutions 4. Common Liquid Cooling Solutions for Data Centers 5. Recent Observations on Adoption of Liquid Cooling Solutions Among Server Manufacturers
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