On April 23, 2026, TSMC unveiled at the 2026 North America Technology Symposium its Compact Universal Photonic Engine (COUPE) platform built on Co-Packaged Optics (CPO) technology, with mass productio...
Mature foundries shift structurally as capacity cuts and AI demand lift utilization and pricing, while Tier 2 players gain order wins.
The semiconductor industry is undergoing a structural shift in 2026, with competition moving beyond process node scaling toward system-level architecture. On the technology front, 2nm gate-all-around...
AI demand reshapes chip supply; advanced nodes and packaging turn scarce, with early lockdowns now defining leadership.
With the generative AI market expanding at a CAGR of over 35%, data throughput for a single large language model (LLM) training task has reached the exabyte (EB) level. As transmission speeds evolve t...
For the current year of 2026, TSMC plans to establish a trial production line CoPoS through its subsidiary, VisEra, with trial production scheduled for 2027. Consequently, this year will be a critical...
Taiwanese foundries face structural shifts: TSMC consolidates 12" mature nodes, UMC hikes 8" prices, VIS pivots to PMICs, and PSMC moves to high-value processes amid supply-demand restructuring.
Driven by AI and general servers, industry value grows robustly. Despite geopolitical risks and custom chip delays, NVIDIA and AMD's push for premium integrated racks significantly boosts average pric...
Driven by strong demand, TSMC accelerates global expansions for advanced nodes and packaging; UMC pushes joint-node sampling despite delays and develops silicon photonics; Vanguard comprehensively rai...
NVIDIA's strategic investment in Lumentum and Coherent secures critical InP laser and high‑power CW light‑source capacity, shifting supply‑chain focus from module assembly to upstream optical componen...
CSPs' AI push fuels HBM shortages and price hikes. Strong conventional DRAM dilutes HBM share; base die production shifts to TSMC.
Driven by robust AI demand, 2026 foundry revenue is set to grow significantly. Advanced nodes and packaging capacities are fully loaded, leading to price hikes. Meanwhile, 8-inch capacity is tightenin...
Driven by AI and new smartphone momentum, 2025 global foundry revenue hit record highs, with TSMC extending its market lead via advanced processes. For 2026, despite pre-stocking triggered by anticipa...
With Google, Meta, and MediaTek all considering adopting Intel’s EMIB packaging technology, Intel’s technological progress in advanced packaging and glass substrates has once again attracted significa...
As Co-Packaged Optics (CPO) moves from the lab toward commercialization, inspection has become the key to achieving mass producibility and long-term system stability. However, CPO inspection still fac...
