CSPs scale ASICs alongside GPUs, lifting packaging demand as CoWoS-L leads while EMIB-T and FOPLP emerge as new options.
In the OCP APAC Summit held in August 2026, suppliers including TSMC, ASE, and AMAT all highlighted the future trends of 3D IC. In September, during SEMICON, the 3DIC Advanced Manufacturing Alliance (...
Driven by AI, next-generation advanced NAND has become the mainstream. As traditional vertical stacking encounters physical limitations and performance degradation, the industry's focus is shifti...
AI drives surging memory demand, prompting capex revisions. However, limited cleanroom space and a shift to advanced tech over raw capacity will constrain future bit output growth. Equipment vendors a...
NAND Flash prices surged amid tight supply. Industry investment focuses on advanced tech: hybrid bonding, process upgrades. Overall bit growth limited.
The comprehensive quarterly reports detailing market trends, supplier comparisons, and forecast data. It provides the critical analysis on HBM production overview, Spec. outlook, and shipment forecast...
The 2Q25 Enterprise SSD market experienced significant growth, driven by robust AI applications and expanding general server deployments. However, severe supply chain challenges, including DDR4 memory...
As indicated by the survey of global market intelligence firm TrendForce, for decades, Moore's Law has driven the exponential growth of the semiconductor industry...
"TrendForce reports AI drives higher NAND Flash transmission performance demands. Samsung, to seize AI edge computing opportunities, accelerates Hybrid Bonding adoption in its V9 (286L) produ...
The booming progression of AI has prompted the demand for increasing performance of storage devices...
Under the influence of growing AI-related demand and the slowing pace of node migration under Moore’s Law, achieving lower power consumption and higher transistor counts on a single chip has become a...
The utilization of chiplets paired with 2.5D and 3D advanced packaging technology is bound to become one of the inevitable development trends of high-end chips in order to allow a continuous elevation...
