Agentic AI and inference reshape workloads, lifting server CPU demand. Shipments surge as CSP in-house Arm CPUs erode x86 share.
Inference demand drives CSP ASIC growth past GPUs; Google's next TPU adopts EMIB-T, with substrate yield key to cost.
Hyperscaler Capex keeps rising on price hikes and shortages; pricier AI racks drive server value growth over volume.
US hyperscalers keep expanding, but midterm-driven backlash may raise costs and delay permits for later-stage projects.
AI chip and server growth accelerates in 2027 on rack-scale systems and ASICs, while HBM and CoWoS supply stays tight.
NVIDIA shipments stay Blackwell-led as Rubin's ramp slips into next year on HBM4 snags, keeping HBM the key bottleneck.
AI chip makers weigh downgrading HBM capacity, hitting capacity for KV cache, lifting offload memory demand, as 8hi stays mainstream.
AI demand keeps HBM shipments strong as technology advances and tight supply shifts pricing power toward suppliers.
HBM supply expands as shares shift; 2026 is a pricing pause, 2027 brings a sharp ASP surge as HBM4 rises.
AI chip demand surges in 2026, with high-end GPUs dominating. NVIDIA leads, ASICs gain share, liquid cooling expands, and AI server value hits record highs.
Diverging HBM4 certification timelines are reshaping 2026 market share, with Samsung gaining ground as SK hynix faces delays.
HBM remains irreplaceable in AI accelerators. HBM4 ramps, tight supply lifts prices, and ASIC demand diversifies the supplier base.
NVIDIA FY1Q27 hit a record high with Data Center share above 92%，with GB/VR Rack rollout boosting liquid cooling and HBM supply chains.
HBM grows strongly in 2026 as CSP/ASIC demand lifts HBM3e prices; SK hynix leads, Samsung rebounds, Micron expands TSV.
NVIDIA's upgraded HBM4 specifications have delayed supplier validations. Samsung, leading in chip performance, is poised to complete certification first and increase market share, while competitors re...
