AI Chip

Custom HBM Rises as Advanced Base Dies Elevate TSMC | TrendForce

Custom HBM Rises as Advanced Base Dies Elevate TSMC

Oct 22, 2026 | PDF

AI chipmakers are adopting custom HBM as base dies move to advanced logic nodes, strengthening TSMC's role in the HBM supply chain.

Foundry Market Bulletin - Oct. 19, 2026 | TrendForce

Foundry Market Bulletin - Oct. 19, 2026

Oct 19, 2026 | PDF

Samsung speeds 8-inch cuts, plans 2027 hikes; AI demand lifts mature nodes as SMIC, Nexchip, HuaHong raise prices, expand.

4Q26 HBM Datasheet | TrendForce

4Q26 HBM Datasheet

Oct 16, 2026 | EXCEL

With our expertise in the memory market, this provides a comprehensive analysis and forecast on HBM market share, ASP, wafer capacity, demand consumption, etc.

Memory Takes Over CSP Capex: 60%+ Share in 2027 | TrendForce

Memory Takes Over CSP Capex: 60%+ Share in 2027

Oct 16, 2026 | PDF

TrendForce has raised the capex forecast for major US and Chinese CSPs. With memory contract prices remaining elevated, memory spending is set to exceed half of total capex, while suppliers are priori...

Agentic AI Revives Server CPUs as Arm Rises | TrendForce

Agentic AI Revives Server CPUs as Arm Rises

Oct 15, 2026 | PDF

Agentic AI and inference reshape workloads, lifting server CPU demand. Shipments surge as CSP in-house Arm CPUs erode x86 share.

Process Control Paradigm Shift: AI Drives Structural Growth in Demand for Metrology and Inspection | TrendForce

Process Control Paradigm Shift: AI Drives Structural Growth in Demand for Metrology and Inspection

Oct 13, 2026 | PDF

AI and advanced nodes are driving a paradigm shift in process control. Although GAA, HBM, and advanced packaging follow different paths, all share one logic: testing costs far less than failure. This...

CSP ASICs Rise as Google TPU Eyes EMIB Packaging | TrendForce

CSP ASICs Rise as Google TPU Eyes EMIB Packaging

Oct 13, 2026 | PDF

Inference demand drives CSP ASIC growth past GPUs; Google's next TPU adopts EMIB-T, with substrate yield key to cost.

AI Server Value Surges on Pricing and Capex Boom | TrendForce

AI Server Value Surges on Pricing and Capex Boom

Oct 08, 2026 | PDF

Hyperscaler Capex keeps rising on price hikes and shortages; pricier AI racks drive server value growth over volume.

US Data Center Buildout Faces Midterm Risks | TrendForce

US Data Center Buildout Faces Midterm Risks

Oct 07, 2026 | PDF

US hyperscalers keep expanding, but midterm-driven backlash may raise costs and delay permits for later-stage projects.

Foundry Market Bulletin - Oct. 5, 2026 | TrendForce

Foundry Market Bulletin - Oct. 5, 2026

Oct 05, 2026 | PDF

Tight 8-inch supply fuels foundry price hikes, as TSMC and peers pivot mature capacity to advanced packaging and SiPh.

AI Server Industry Analysis-3Q26 | TrendForce

AI Server Industry Analysis-3Q26

Oct 02, 2026 | PDF

AI chip and server growth accelerates in 2027 on rack-scale systems and ASICs, while HBM and CoWoS supply stays tight.

3Q26 Server Diamond Datasheet | TrendForce

3Q26 Server Diamond Datasheet

Oct 01, 2026 | EXCEL

TrendForce combines its expertise in memory market and leverage it to provide a multi-faceted study of server market in this report. The content of it is as follows: 1. Server CPU Market: State of Co...

NVIDIA Rubin Ramp Delayed to 2027 on HBM Snag | TrendForce

NVIDIA Rubin Ramp Delayed to 2027 on HBM Snag

Sep 21, 2026 | PDF

NVIDIA shipments stay Blackwell-led as Rubin's ramp slips into next year on HBM4 snags, keeping HBM the key bottleneck.

HBM Downgrade Drives KV Cache Offload Demand | TrendForce

HBM Downgrade Drives KV Cache Offload Demand

Sep 21, 2026 | PDF

AI chip makers weigh downgrading HBM capacity, hitting capacity for KV cache, lifting offload memory demand, as 8hi stays mainstream.

Foundry Market Bulletin - Sep. 21, 2026 | TrendForce

Foundry Market Bulletin - Sep. 21, 2026

Sep 21, 2026 | PDF

Non-TSMC foundries head into 2027 with higher utilization, price hikes, and sustained strong revenue growth.

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