TrendForce combines its expertise in the Foundry/Server industry and leverages it with the supply chain to accurately estimate AI chip shipments, AI Server application ratios, AI major suppliers&a...
TrendForce combines its expertise in memory market and leverage it to provide a multi-faceted study of server market in this report. The content of it is as follows: 1. Server CPU Market: State of Co...
CSPs scale ASICs alongside GPUs, lifting packaging demand as CoWoS-L leads while EMIB-T and FOPLP emerge as new options.
As AI chips require increasingly stable power delivery, Si‑Cap (silicon capacitors) and their embedded/integrated packaging have become an important technological development direction, and key compan...
As AI shifts from training to inference and agentic workloads, Server CPU evolves from auxiliary to core orchestrator, lifting both ARM and x86 demand into a new growth cycle.
AI demand and proprietary chip adoption drive upward revisions in global server shipments. Despite supply bottlenecks, memory face severe shortages and soaring prices. AMD and alternative architecture...
Intel 18A yield beats plan, 14A wins Tesla. Niche logic with EMIB/Foveros and PowerVia could reshape foundry race.
On March 16th 2026, NVIDIA used GTC to debut the first standalone Vera CPU Rack for sale. On March 25th, Arm announced its own Arm AGI CPU and introduced two CPU rack variants (air‑cooling and liquid‑...
AI drives huge server memory demand. Depleted inventory sparks surging prices. Custom chips disrupt processor markets.
Market Flash is a dedicated membership program that provides clients with access to special reports on display-related markets, offering timely insights and exclusive research updates through a secure...
Market Flash is a dedicated membership program that provides clients with access to special reports on display-related markets, offering timely insights and exclusive research updates through a secure...
Tariff shifts and geopolitical conflicts drive up supply chain costs. While AI infrastructure remains robust, PC and smartphone markets weaken under rising component prices. This polarization, coupled...
With Google, Meta, and MediaTek all considering adopting Intel’s EMIB packaging technology, Intel’s technological progress in advanced packaging and glass substrates has once again attracted significa...
Intel is expanding advanced packaging globally to secure CSP orders but trails TSMC in yield and turnkey solutions. Despite EMIB's technical challenges, the growing AI market offers opportunities...
North American CSPs' expanded investment in AI and general servers has confirmed a DRAM industry upcycle. With supplier inventory bottoming out and buyers actively restocking, prices and revenue...
