AI Chip

As Diverse Applications Drive Market Growth of HBM, 2.5D Packaging Plays a Critical Role in Development of This Memory Solution | TrendForce

As Diverse Applications Drive Market Growth of HBM, 2.5D Packaging Plays a Critical Role in Development of This Memory Solution

Jun 09, 2023 | PDF

The load of cloud computing will continue to elevate under the advancement of diversified applications, where restricted growth of performance in DDR SDRAM could encumber the performance of computing...

Development of AI Servers and GPGPU Will Flourish in Era of Parallel Computing | TrendForce

Development of AI Servers and GPGPU Will Flourish in Era of Parallel Computing

Jun 08, 2023 | PDF

Values of AI servers and corresponding computing cores GPGPU (General-Purpose Computing on Graphics Processing Unit) in parallel computing as LLM (Large Language Model), which excels in NLP (Natural L...

Foundry Market Bulletin_20230605 | TrendForce

Foundry Market Bulletin_20230605

Jun 05, 2023 | PDF

Samsung Device Solutions (DS) is divided into four divisions, including Memory, System LSI, Foundry, and Advanced Package (AVP)...

Hybrid Bonding Technology Portrays Essential Role as Advanced Packaging Continues to Evolve | TrendForce

Hybrid Bonding Technology Portrays Essential Role as Advanced Packaging Continues to Evolve

May 31, 2023 | PDF

The utilization of chiplets paired with 2.5D and 3D advanced packaging technology is bound to become one of the inevitable development trends of high-end chips in order to allow a continuous elevation...

Suppliers to Safeguard Bottom Prices; Contract Prices for Partial NAND Flash Wafers Could Rise in Chinese Market in June | TrendForce

Suppliers to Safeguard Bottom Prices; Contract Prices for Partial NAND Flash Wafers Could Rise in Chinese Market in June

May 30, 2023 | PDF

As indicated by the latest survey of global market intelligence firm TrendForce, mainstream NAND Flash wafer prices that have been lingering below cash cost are yielding enormous financial pressure on...

Comprehensive Analysis on Global IC Design Industry in 2023 (Presentation) | TrendForce

Comprehensive Analysis on Global IC Design Industry in 2023 (Presentation)

May 26, 2023 | PDF

1. Overall Performanc 2. R&D Expenses among IC Design Houses 3. Inventory 4. Performance in Other Areas 5. Competition of Smartphone SoC Market 6. TRI’s View

Mobile DRAM Revenue for 1Q23 Showed Marginal Rebound of 6.1%, but Suppliers Will Still Face Challenges in 2Q23 as Price Decline Has Yet to Ease | TrendForce

Mobile DRAM Revenue for 1Q23 Showed Marginal Rebound of 6.1%, but Suppliers Will Still Face Challenges in 2Q23 as Price Decline Has Yet to Ease

May 25, 2023 | PDF

According to the global market intelligence firm TrendForce, the global smartphone production for 1Q23 was impacted by weaknesses in the macroeconomic environment and...

China’s Matured Node Expansion Overcasted as Japan Announced Export Control Regulations on Semiconductor Equipment | TrendForce

China’s Matured Node Expansion Overcasted as Japan Announced Export Control Regulations on Semiconductor Equipment

May 24, 2023 | PDF

As indicated by the survey of global market intelligence firm TrendForce, since the US Department of Commerce extended its semiconductor sanction from logic IC to memory and HPC chips for supercompute...

Foundry Market Bulletin_20230522 | TrendForce

Foundry Market Bulletin_20230522

May 22, 2023 | PDF

Terminal sales that have yet to see a recovery, together with the worse-than-expected reduction of inventory among upstream IC design clients...

Foundry Market Bulletin_20230508 | TrendForce

Foundry Market Bulletin_20230508

May 08, 2023 | PDF

Off season in the consumer market, together with inventory revisions among clients, had affected Samsung Foundry’s performance in shipment and capacity utilization, which shrank its 1Q23 revenue to...

Era of Machine Data: Analysis on Training and Inference Applications of AI Servers | TrendForce

Era of Machine Data: Analysis on Training and Inference Applications of AI Servers

May 08, 2023 | PDF

The expectation that AI would introduce immense benefits to the commercial market has prompted major suppliers to engage in AI training, which yielded the demand for hardware equipment. AI is currentl...

Foundry Market Bulletin_20230424 | TrendForce

Foundry Market Bulletin_20230424

Apr 24, 2023 | PDF

TSMC mentioned from its earnings call on April 20th that the foundry had suffered a QoQ drop of 12.8% in 1Q23 wafer shipment under clients’ inventory revisions...

Foundry Market Bulletin_20230410 | TrendForce

Foundry Market Bulletin_20230410

Apr 10, 2023 | PDF

The subsidy specifications of the CHIPS Act by the US government restrict applicants’ investment on 1X nm and below advanced nodes, as well as 28nm and above matured nodes...

To Minimize Geopolitical Risks, ODMs and Material Suppliers in Server Supply Chain Continue with Relocation of Their Production Sites | TrendForce

To Minimize Geopolitical Risks, ODMs and Material Suppliers in Server Supply Chain Continue with Relocation of Their Production Sites

Mar 31, 2023 | PDF

Continuing from the previous report on the server supply chain that was published on December 29, 2022, TrendForce has observed that in addition to Taiwan-based ODMs moving their production sites...

Foundry Market Bulletin_20230327 | TrendForce

Foundry Market Bulletin_20230327

Mar 27, 2023 | PDF

The subsidization regulations from the CHIPS Act, issued by the US Department of Commerce on March 21st...

Get in touch with us


Get in touch with us