Just a day after its STAR Market listing, Unitree Robotics is striking a cautious note on the next major breakthrough in humanoid robotics. According to EE Times China, Chairman Wang Xingxing said at World Robot Conference that the industry’s long-awaited “ChatGPT moment” for embodied AI coul...

Advanced packaging is taking on a bigger role as AI reshapes how semiconductor systems are designed and manufactured. Rapidus is responding with a roadmap centered on larger interposers and panel-level packaging. According to TechNews, Rozalia Beica, CTO of packaging at Rapidus Design Solutions, out...

STMicroelectronics has again notified customers of price increases. According to EE Times China, this marks its third price hike in 2026, with prices across multiple product lines set to rise from August 23. The company cited strong semiconductor demand across multiple sectors and rising costs for t...

Samsung’s foundry revival has become a hot topic, as Reuters reported earlier that the company has raised 4nm-led advanced nodes prices by up to 15%, with Chinese clients seeing the largest degree of hikes. The interpretation behind this move, according to ijiwei, could signal a fundamental shift ...

In a TechSurge podcast released last week, Intel CEO Lip-Bu Tan signaled the chip giant’s growing interest in memory, saying the company does not intend to miss the next major wave. As Intel explores technologies such as cross-batch memory (XBM) and Z-angle memory (ZAM), it is worth looking back a...