[News] AMD’s Lisa Su Visits TSMC, AI Supply Chain Partners as Company Locks In Capacity 3–5 Years Ahead
AMD Chair and CEO Lisa Su made a brief visit to Taiwan as the company moves to expand supply for its growing AI business. According to Liberty Times, Su said AMD’s previously announced plan to invest more than US$10 billion in Taiwan’s industrial ecosystem remains fully on track, with further investments expected.
Su said AMD is increasing supply this year and plans to ramp it significantly further in 2027 as demand for AI-related products, including CPUs and GPUs, exceeds expectations. TSMC, backend manufacturing partners, and substrate suppliers are all increasing capacity, with Su’s visit aimed at ensuring the entire supply chain can expand accordingly, the report notes.
According to Wealth Magazine, the rapid growth is also changing how far ahead AMD plans with its partners. Su said capacity planning that once looked one to two years ahead now extends three, four, or even five years, with wafer fabrication, packaging, and substrates all needing to be ready at the same time.
Advanced packaging is a key part of those plans. Su said rising AI chip shipments are increasing demand for CoWoS, while AMD is also exploring other packaging approaches, including Fan-Out PLP with Taiwan’s supply chain. As Wealth Magazine notes, AMD does not view Fan-Out PLP as a replacement for CoWoS, with Su stressing that both CoWoS and other advanced packaging technologies will remain important.
Next-Generation AI Platforms Drive Capacity Expansion
The capacity push comes as AMD ramps its next-generation AI platforms. As noted by Economic Daily News, AMD began production of its MI450-series AI platform in the second half of 2026, using TSMC’s 2nm node and CoWoS. The MI450 series entered production at TSMC in the third quarter, with capacity expected to ramp gradually by the end of 2026 before higher-volume shipments begin in 2027. According to the report, the succeeding MI455 series is scheduled to enter production in the first half of 2027, with preparations for its ramp now in focus.
Asked whether TSMC has sufficient capacity to meet AMD’s needs, Su said the company is working closely with all of its partners, including TSMC, TechNews notes. She added that TSMC’s new fab in Arizona is progressing very well and that AMD looks forward to seeing more capacity expand globally to meet strong market demand.
Taiwan Supply Chain Supports AMD’s AI Server Push
The ramp-up is also expected to drive greater demand across AMD’s Taiwan AI server supply chain. Foxconn is among the Taiwanese suppliers positioned to benefit from AMD’s expansion. Economic Daily News notes that the company is one of AMD’s major AI server suppliers, with its involvement spanning substrates and thermal modules to complete AI server assembly for cloud service providers including Microsoft and Oracle. The group also supplies high-speed switches and optical transmission equipment alongside AMD-based servers.
AMD Looks to Secure Memory Supply in South Korea
AMD is also working closely with memory chipmakers to secure sufficient supplies, Su said ahead of her visit to South Korea, home to Samsung and SK hynix, Reuters notes. Whether Su will hold another high-level meeting with Samsung Electronics executives is drawing attention. As highlighted by Seoul Economic Daily, Samsung is set to supply sixth-generation HBM4 for AMD’s next-generation GPUs, while further talks may include discussions on expanding their partnership beyond memory into areas such as mobile devices and AI PCs. Attention is also on whether Su will meet with executives from SK hynix and LG Electronics, the report adds.
Read more
- [News] AMD Reportedly Plans 10% Price Hike for GPUs, AI Chips, Chipsets in 4Q26 as TSMC Costs Rise
- [News] Marvell, AMD Reportedly Shake Up Google TPU Race, Putting Broadcom, MediaTek Under Pressure
(Photo credit: AMD)
