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Recent Posts
- [News] China’s OSAT Giants Step Up: Tongfu Microelectronics to Raise RMB 4.4B; JCET Backs Chip Fund
- [News] Out with the Old: Memory Giants Map Their 2025-26 Exit Strategy amid Supply Crunch
- [News] Expert Says HBF May Be Deployed in NVIDIA GPUs by 2027–28; Market Could Surpass HBM by 2038
- [News] SK hynix Unveils 5-Bit NAND That Splits Cells, Delivers 20× Faster Reads
- [News] MediaTek Debuts Dimensity 9500s on TSMC 3nm and 4nm 8500, Targeting Upper-Midrange Market
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Monthly Archives: January 2026
[News] China’s OSAT Giants Step Up: Tongfu Microelectronics to Raise RMB 4.4B; JCET Backs Chip Fund
China’s packaging and testing industry is stepping up, with a surge in domestic investment fueling growth. According to ijiwei, from late 2025 to early 2026, leading A‑share OSAT companies have been particularly active, signaling a shift toward higher-end and more …
[News] Out with the Old: Memory Giants Map Their 2025-26 Exit Strategy amid Supply Crunch
Amid tightening memory supply, the industry is shifting focus to high-margin, cutting-edge products catering to hyperscalers. Legacy, consumer-oriented memory is gradually reaching end-of-life, with 2026 poised as a watershed year for key players. Here’s a look at how Samsung, SK …
Posted in DRAM, NAND Flash, Semiconductors
Tagged DDR4, Micron, MLC, Samsung, SK Hynix
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[News] Expert Says HBF May Be Deployed in NVIDIA GPUs by 2027–28; Market Could Surpass HBM by 2038
As AI workloads continue to grow, high-bandwidth flash (HBF) is gaining momentum, with experts forecasting earlier-than-expected commercialization. According to Sisa Journal, KAIST professor Joungho Kim—widely regarded as the “father of HBM”—indicates that Samsung Electronics and SanDisk plan to integrate HBF …
[News] SK hynix Unveils 5-Bit NAND That Splits Cells, Delivers 20× Faster Reads
Memory giants are treading carefully on NAND capacity expansion and phasing out older products like MLC (Multi-Level Cell), while doubling down on advanced technologies. Notably, at the San Francisco 2025 IEDM conference in December, SK hynix unveiled its cutting-edge 5-bit …
[News] MediaTek Debuts Dimensity 9500s on TSMC 3nm and 4nm 8500, Targeting Upper-Midrange Market
MediaTek has unveiled the Dimensity 9500s and Dimensity 8500, targeting the upper-midrange smartphone market. According to ijiwei, the Dimensity 9500s represents an expansion of the Dimensity 9000 series lineup. It is built on TSMC’s 3nm process and continues MediaTek’s all-big-core …