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- [News] China’s OSAT Giants Step Up: Tongfu Microelectronics to Raise RMB 4.4B; JCET Backs Chip Fund
- [News] Out with the Old: Memory Giants Map Their 2025-26 Exit Strategy amid Supply Crunch
- [News] Expert Says HBF May Be Deployed in NVIDIA GPUs by 2027–28; Market Could Surpass HBM by 2038
- [News] SK hynix Unveils 5-Bit NAND That Splits Cells, Delivers 20× Faster Reads
- [News] MediaTek Debuts Dimensity 9500s on TSMC 3nm and 4nm 8500, Targeting Upper-Midrange Market
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Monthly Archives: December 2025
[News] U.S. Think Tank Flags DUVi Loopholes as China Pushes Toward Advanced Chips Using Multipatterning
China is reported to have built an EUV lithography prototype by reverse-engineering older ASML tools, drawing industry attention. However, the larger concern may lie less in technological catch-up than in potential loopholes in existing export controls. According to a report …
[News] TSMC’s Bold Pivot: Kumamoto Fab 2 Reportedly Leaps from 6nm to 2nm amid JASM Losses
While TSMC’s Arizona expansion races ahead, its Japan operations are moving at a slower pace, drawing close attention. Plans for Kumamoto Fab 2, however, may be shifting. A Nikkei report had suggested a move to 4nm—originally planned for 6nm and …
[News] DNP Advances TGV Glass Substrates, Eyes Early-2026 Sample Shipments, FY2028 Mass Production
With glass substrates gaining traction as a next-generation packaging solution, Japan’s Dai Nippon Printing (DNP) is stepping up its efforts. According to EE Times Japan, the company will begin phased operations of its newly established pilot line for TGV (Through-Glass …
[News] GF, onsemi Join Forces to Co-Develop GaN Power Devices, Accelerating Ambitions with Samples Due 1H26
Global IDM leaders are charting contrasting strategies in the GaN sector. NXP reportedly plans to phase out its radio power product line and close its GaN RF fab in Arizona by 2027, while onsemi is taking an aggressive approach, partnering …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged GaN, GlobalFoundries, Onsemi
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[News] SK hynix Reportedly Expands U.S. Footprint with New Seattle Office Near NVIDIA and Amazon
As SK hynix ramps up ties with major tech players like NVIDIA, advancing U.S. production through its Indiana advanced packaging plant is just one part of its strategy. According to the Puget Sound Business Journal via The Guru, the memory …