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Recent Posts
- [News] China’s OSAT Giants Step Up: Tongfu Microelectronics to Raise RMB 4.4B; JCET Backs Chip Fund
- [News] Out with the Old: Memory Giants Map Their 2025-26 Exit Strategy amid Supply Crunch
- [News] Expert Says HBF May Be Deployed in NVIDIA GPUs by 2027–28; Market Could Surpass HBM by 2038
- [News] SK hynix Unveils 5-Bit NAND That Splits Cells, Delivers 20× Faster Reads
- [News] MediaTek Debuts Dimensity 9500s on TSMC 3nm and 4nm 8500, Targeting Upper-Midrange Market
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Monthly Archives: November 2025
[News] SK hynix, Samsung, and SanDisk Bet on HBF — The Next Battleground in Memory Sector
Kim Jung-Ho, a professor at KAIST and widely known as the “father of HBM (High Bandwidth Memory),” recently made a striking statement on a YouTube program: “In the AI era, the balance of power is shifting — from GPU to …
[News] SK hynix Reportedly Explores High-Bandwidth Storage Stacking NAND and DRAM
After solidifying its leadership in HBM, SK hynix is teaming up with SanDisk to develop High-Bandwidth NAND Flash (HBF), which enhances HBM with NAND for AI inference workloads. At the same time, the company is reportedly exploring a broader memory …
[News] Samsung Reportedly Eyes Feb. 2026 Galaxy S26 Launch; Ultra Model May Stick With Qualcomm
Samsung is moving forward with its Exynos comeback, aiming to reduce its dependence on Qualcomm chips. According to Chosun Biz, citing sources, Samsung Electronics plans to use the Exynos 2600 in the base and Plus models, while the Ultra model …
Posted in Consumer Electronics, Semiconductors
Tagged exynos 2600, Galaxy S26, Qualcomm, Samsung, Snapdragon
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[News] TSMC CoWoS Capacity Crunch Reportedly Pushes U.S. AI Chipmakers to Powertech Through 2027
AI is fueling a surge in demand for advanced packaging, and TSMC’s capacity in this segment is reportedly running tight. According to Economic Daily News, with most of TSMC’s advanced packaging capacity taken up by NVIDIA, several major U.S. AI …
Posted in Artificial Intelligence, Emerging Technologies, Semiconductors
Tagged advanced packaging, Powertech, TSMC
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[News] Micron’s New York Megafabs Reportedly Face 2–3 Year Delay, First Now Set for Late 2030
While Micron has already sold out its 2026 HBM supply, the company appears to be taking a cautious approach to capacity expansion. According to syracuse.com and Spectrum News 1, the opening of its first two chip fabs in Clay, New …