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- [News] Out with the Old: Memory Giants Map Their 2025-26 Exit Strategy amid Supply Crunch
- [News] Expert Says HBF May Be Deployed in NVIDIA GPUs by 2027–28; Market Could Surpass HBM by 2038
- [News] SK hynix Unveils 5-Bit NAND That Splits Cells, Delivers 20× Faster Reads
- [News] MediaTek Debuts Dimensity 9500s on TSMC 3nm and 4nm 8500, Targeting Upper-Midrange Market
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Monthly Archives: August 2025
[News] GlobalFoundries Reportedly Cuts U.S. Jobs, Says CHIPS Act Funding Involves No Equity
According to Times Union, chipmaker GlobalFoundries said it has made “adjustments” to its workforce at Fab 8, its plant in Malta, Saratoga County, New York. The report notes that despite the company’s ongoing $16 billion expansion of its manufacturing operations …
[News] SK hynix Launches Industry-First High-K EMC Mobile DRAM with 3.5x Higher Thermal Conductivity
While performance drop caused by heat has become not only an issue for AI data centers but for smartphones as well, SK hynix announced that it has begun supplying mobile DRAM with industry-first High-K Epoxy Molding Compound, offering highly efficient heat …
[News] Intel Faces Another Executive Exodus: Advanced Packaging Director Leaves for Analog Devices
While Intel recently agreed to transfer a 10% stake to the U.S. government, the chipmaker continues to suffer from a wave of veteran executive departures. As per Oregon Live, Narahari Ramanuja, a 25-year Intel veteran, is leaving to head Analog …
[News] Samsung Reportedly Weighs Intel Packaging Investment, Glass Substrate Tie-Up to Challenge TSMC
According to South Korean outlet Business Post, sources indicate that Samsung is weighing investment in Intel’s packaging business — an area where Intel has a competitive edge — and is also exploring the use of Intel’s packaging production lines in …
Posted in Semiconductors
Tagged advanced packaging, Glass Substrates, Intel, Samsung
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[News] TSMC’s 2nm Leak Update: 3 Engineers Indicted for Stealing Core Tech, Facing Up to 14 Years
Shortly after the TSMC 2nm leak involving former and current staff came to light, Taiwan’s High Prosecutors Office indicted three engineers on August 27 for misappropriating national core technology secrets. Prosecutors are seeking 7–14 year prison terms under national security …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged 2nm, Tokyo Electron, TSMC
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