Optical Interconnects

CIOE 2026 Exhibit Report- Near-Eye Display | TrendForce

CIOE 2026 Exhibit Report- Near-Eye Display

Sep 22, 2026 | PDF

This exhibition report focuses on two key components of near-eye displays—light engines and waveguides. By tracking the product development and capacity expansion of major suppliers, the report provid...

2026 Micro LED Display and Non-Display Application Market Analysis | TrendForce

2026 Micro LED Display and Non-Display Application Market Analysis

Sep 15, 2026 | PDF

This report uncovers the overall Micro LED market size and provides an in-depth analysis of distinct Micro LED applications and manufacturer dynamics, spanning various glass-based display applications...

Foundry Market Bulletin - Aug. 17, 2026 | TrendForce

Foundry Market Bulletin - Aug. 17, 2026

Aug 17, 2026 | PDF

2Q26 foundry revenue rose broadly; overseas, China fab expansion should keep capacity tight, lifting full-year momentum.

IC and Semi Research Report-3Q26 | TrendForce

IC and Semi Research Report-3Q26

Jul 29, 2026 | PDF

From a professional analyst's perspective, the global semiconductor market is strongly driven by surge in artificial intelligence and cloud computing, boosting high-performance chips and opti...

AI Infra Market Bulletin – Jul. 16, 2026 | TrendForce

AI Infra Market Bulletin – Jul. 16, 2026

Jul 16, 2026 | PDF

As global computing power expands, traditional cabling faces severe thermal and power bottlenecks. Emerging Micro LED CPO technology, with its micron-level size and ultra-low power consumption, has be...

AI Infra Market Bulletin – Jun. 11, 2026 | TrendForce

AI Infra Market Bulletin – Jun. 11, 2026

Jun 11, 2026 | PDF

The year 2026 marks the watershed transition of AI data center optical interconnects from adoption to mass production. The actual volume driver is not scale-out CPO switches, but GPU scale-up networks...

CPO Technology Revolution: Next-Gen Interconnect for AI Data Centers | TrendForce

CPO Technology Revolution: Next-Gen Interconnect for AI Data Centers

Jun 05, 2026 | PDF

Co-packaged optical (CPO) technology is entering the commercialization stage, driven by AI data center demand for higher bandwidth and lower power consumption. Volume production begins in 2026, with l...

2026 AI Optical Trends: Co-Packaged Optics & Silicon Photonics | TrendForce

2026 AI Optical Trends: Co-Packaged Optics & Silicon Photonics

May 27, 2026 | PDF

Optical interconnects in AI data centers are shifting from legacy pluggable optics toward LPO, CPO and OCS. LPO streamlines the signal chain to improve power while keeping a pluggable model, CPO co‑pa...

2026 Micro LED Display and Non-Display Application Market Analysis- Micro LED Optical Interconnect Application Preview | TrendForce

2026 Micro LED Display and Non-Display Application Market Analysis- Micro LED Optical Interconnect Application Preview

May 14, 2026 | PDF

The 2026 Micro LED Report (to be published at the end of September 2026) covers trends in large-sized displays, automotive displays, wearable displays, head-mounted displays, optical interconnect appl...

2026 Infrared Sensing Application Market and Branding Strategies - Micro LED CPO Market Value Analysis | TrendForce

2026 Infrared Sensing Application Market and Branding Strategies - Micro LED CPO Market Value Analysis

May 05, 2026 | PDF

The supplementary information covers: 1. 2026 Optical Communication Market Trend 2. Micro LED CPO / VCSEL NPO Market Opportunities and Challenges 3. 2026-2030 Transceiver vs. Micro LED CPO Transceiver...

Optical Interconnect Supply Chain Restructuring and Opportunities in Response to Expanded US Export Controls | TrendForce

Optical Interconnect Supply Chain Restructuring and Opportunities in Response to Expanded US Export Controls

Apr 30, 2026 | PDF

As U.S. export controls extend from chips to AI infrastructure, the traditional optical interconnect industry is undergoing supply chain restructuring. While optical modules are not subject to blanket...

The CPO Paradigm Shift in the AI Era: Strategic Opportunities for Taiwan’s Ecosystem and the Future of Interconnect Architecture | TrendForce

The CPO Paradigm Shift in the AI Era: Strategic Opportunities for Taiwan’s Ecosystem and the Future of Interconnect Architecture

Apr 22, 2026 | PDF

With the generative AI market expanding at a CAGR of over 35%, data throughput for a single large language model (LLM) training task has reached the exabyte (EB) level. As transmission speeds evolve t...

AI Interconnect Outlook: NVIDIA Leads the Transition to CPO and Silicon Photonics Architectures | TrendForce

AI Interconnect Outlook: NVIDIA Leads the Transition to CPO and Silicon Photonics Architectures

Apr 16, 2026 | PDF

NVIDIA shifts AI competition from computing performance to system interconnects, leveraging CPO and silicon photonics to break I/O bottlenecks. By integrating high-speed fabric with advanced packaging...

OFC 2026 Exhibit Report | TrendForce

OFC 2026 Exhibit Report

Mar 27, 2026 | PDF

The Optical Fiber Communication Conference and Exposition (OFC) was hosted at the Los Angeles Convention Center from March 17-19, 2026. As the world’s largest annual event in optical communications, t...

2026 Outlook: NVIDIA Rubin Drives New Wave of AI Hardware Upgrades | TrendForce

2026 Outlook: NVIDIA Rubin Drives New Wave of AI Hardware Upgrades

Mar 18, 2026 | PDF

As data centers adopt HVDC architectures to reduce grid-to-chip power losses, demand for advanced power conversion and next-gen semiconductors surges. Meanwhile, Asian manufacturers continue to domina...

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