The semiconductor industry is undergoing a structural shift in 2026, with competition moving beyond process node scaling toward system-level architecture. On the technology front, 2nm gate-all-around...
AI demand reshapes chip supply; advanced nodes and packaging turn scarce, with early lockdowns now defining leadership.
Driven by AI and general servers, industry value grows robustly. Despite geopolitical risks and custom chip delays, NVIDIA and AMD's push for premium integrated racks significantly boosts average pric...
Intel is expanding advanced packaging globally to secure CSP orders but trails TSMC in yield and turnkey solutions. Despite EMIB's technical challenges, the growing AI market offers opportunities...
AI-driven demand push chiplet-based packaging; EMIB costs less than CoWoS, signaling a move to modular, efficient interconnects.
The latest Foundry Newsletter reports analyzes the global foundry market, noting demand-supply dynamics, yield issues across fabs, and shifting supply chains amid uncertainty.
Oracle's demand for GB Rack surges; production complexity slows early shipments; NVIDIA H20 faces geopolitical challenges but retains growth potential.
The AI ASIC market is rapidly expanding, with TPUs shifting from internal use to external commercialization due to their energy efficiency and customization. Leading cloud and tech firms actively deve...
Glass substrates are emerging as a highly promising solution in advanced semiconductor packaging with recent breakthroughs in Through-Glass Via (TGV) technology. They are poised to drive innovation in...
AI chip boom drives CoWoS expansion, straining raw material supply for ABF and BT substrates, delaying NAND Flash output.
"TSMC's North America Technology Symposium unveiled a roadmap for advanced packaging solutions, showcasing the 3DFabric® platform, which includes wafer level 3D stacking and advanced packagi...
"TrendForce reports TSMC's recent CoWoS capacity adjustment is due to prior customer overbooking, but CSP demand remains largely unchanged. 2025 CoWoS total demand is...
According to the latest supply chain survey by TrendForce, recent adjustments in TSMC’s CoWoS production capacity can be assessed from both supply and demand perspectives...
TrendForce indicates that NVIDIA will increase shipments of Blackwell GPUs featuring CoWoS-L in 2025, while US trade restrictions may reduce demand for CoWoS-S. NVIDIA's adjusted CoWoS order...
According to the latest research by global market intelligence firm TrendForce, shipments of chips under NVIDIA’s new Blackwell platform, which is set to launch in 2025...
