AI chipmakers are adopting custom HBM as base dies move to advanced logic nodes, strengthening TSMC's role in the HBM supply chain.
TrendForce research team offers monthly shipment report of the top 12 monitor brand vendors to keep clients updated on latest shipments changes of the major brands. In addition to top 12 brand vendors...
Samsung speeds 8-inch cuts, plans 2027 hikes; AI demand lifts mature nodes as SMIC, Nexchip, HuaHong raise prices, expand.
With our expertise in the memory market, this provides a comprehensive analysis and forecast on HBM market share, ASP, wafer capacity, demand consumption, etc.
TrendForce has raised the capex forecast for major US and Chinese CSPs. With memory contract prices remaining elevated, memory spending is set to exceed half of total capex, while suppliers are priori...
AI and advanced nodes are driving a paradigm shift in process control. Although GAA, HBM, and advanced packaging follow different paths, all share one logic: testing costs far less than failure. This...
Inference demand drives CSP ASIC growth past GPUs; Google's next TPU adopts EMIB-T, with substrate yield key to cost.
Tight 8-inch supply fuels foundry price hikes, as TSMC and peers pivot mature capacity to advanced packaging and SiPh.
The Diamond reports cover major foundries such as TSMC, UMC, Samsung, SMIC, and GlobalFoundries, etc. The Diamond reports provide extended analyses of these foundries&a...
TrendForce research team offer ASP on TV and monitor of the current month, which is surveyed and classified by sizes, regions, BLU, and 3D/non-3D. The data is collected from representative websites (s...
Panel price forecast includes monthly average prices and price forecast in the next year for LCD TV panel, LCD monitor panel, and notebook panel. Based on current economic conditions, panel makers' ca...
TrendForce research team offers monthly shipment report of the top 12 monitor brand vendors to keep clients updated on latest shipments changes of the major brands. In addition to top 12 brand vendors...
NVIDIA shipments stay Blackwell-led as Rubin's ramp slips into next year on HBM4 snags, keeping HBM the key bottleneck.
AI chip makers weigh downgrading HBM capacity, hitting capacity for KV cache, lifting offload memory demand, as 8hi stays mainstream.
Non-TSMC foundries head into 2027 with higher utilization, price hikes, and sustained strong revenue growth.
