Global AI server momentum builds as CSPs expand rack buys, hyperscalers advance in-house chips, and OEM orders grow.
AI demand reshapes foundry priorities: photonics, packaging gains, tight mature nodes, rising power investment.
CSP capex growth lifts server and AI shipments, chip forecasts rise, ODMs shift to racks, cooling gains traction.
3Q26 humanoid competition shifts from specs to scene penetration and data loops, with diversified forms, China's 107% YoY shipment lead, and emerging chip and companion economies.
Major foundries push fab buildouts, transfer orders, price talks, and specialty processes to boost capacity.
AI chip demand surges in 2026, with high-end GPUs dominating. NVIDIA leads, ASICs gain share, liquid cooling expands, and AI server value hits record highs.
The surge in demand for AI chips and high-speed servers is driving the demand for high-end fiberglass cloth. However, constrained by technical barriers, equipment bottlenecks, and yield challenges, th...
The AI industry entered a critical transition period in 2025, marked by the rapid expansion of LLMs and the large-scale commercialization of AI applications. For China’s semiconductor industry, this r...
Foundry pricing trends tighten across mature nodes in 2026, with AI demand driving advanced-process overflow orders and reshaping competitive dynamics.
Huang backs Korea robotics as memory and manufacturing strengths align with the K-Humanoid Alliance, advancing Physical AI while edge computing and AI chip gaps remain to be closed.
Global server growth accelerates in 2026 as CSPs expand AI infrastructure investment and custom silicon adoption reshapes procurement strategies.
Taiwan foundries including TSMC, UMC, Vanguard, and PSMC are raising prices amid tight capacity, with increases set to extend into 2027.
Taiwan foundries including TSMC, UMC, Vanguard, and PSMC are raising prices amid tight capacity, with increases set to extend into 2027.
TrendForce raised its 2026 global server shipment forecast, driven by surging AI server demand from CSPs and enterprises, with momentum expected through 2027.
On February 16th 2026, MediaTek CEO Rick Tsai stated in his ISSCC 2026 keynote that the basic unit for measuring AI compute efficiency will no longer be just the AI chip, but the entire AI system, inc...
