Advanced Packaging

FOPLP to Accommodate Different Types of Suppliers with Market Segmentation | TrendForce

FOPLP to Accommodate Different Types of Suppliers with Market Segmentation

Sep 04, 2024 | PDF

(a) incentives for chip makers to adopt FOPLP solution: AI GPU makers pursuing chip packaging size expansion could adopt chip-last solution, while power IC and RF IC makers pursuing packaging cost red...

Foundry Market Bulletin_20240902 | TrendForce

Foundry Market Bulletin_20240902

Sep 02, 2024 | PDF

Samsung Foundry, who focuses on the development and mass production of advanced nodes, will continue to concentrate on establishing 3nm, 2nm, and a small volume of 1.4nm R&D lines for capacity expansi...

Foundry Market Bulletin_20240819 | TrendForce

Foundry Market Bulletin_20240819

Aug 19, 2024 | PDF

Despite resilient demand and restricted provision for TSMC’s advanced nodes 5/4nm and 3nm that has led to a price increase of roughly 5-10% for corresponding foundry and advanced CoWoS packaging start...

Foundry Market Bulletin_20240805 | TrendForce

Foundry Market Bulletin_20240805

Aug 05, 2024 | PDF

The workers’ union of Samsung has started a labor strike since mid-July. As reported, the strike is primarily affecting its 8-inch fabs that have now dropped to a capacity utilization of 30%...

Foundry Market Bulletin_20240722 | TrendForce

Foundry Market Bulletin_20240722

Jul 22, 2024 | PDF

TSMC generated US$20.82 billion (calculation based on US$1=NT$32.35) of revenue in 2Q24 at a QoQ growth of 10.5% attributed to how the ramped up shipment of 3nm, together with the continuance of AI-re...

Foundry Market Bulletin_20240708 | TrendForce

Foundry Market Bulletin_20240708

Jul 08, 2024 | PDF

Recent rumors from the market are saying that Samsung’s in-house Exynos 2500 remains low and unstable in yield, and the new S25 slated for release in 2025 could either fully adopt Qualcomm’s products....

AMD and NVIDIA Take the Lead in Transitioning to FOPLP for PC CPU, PMIC, and AI GPU to Reduce Cost and Expand Packaging Sizes of Large-Sized Chips | TrendForce

AMD and NVIDIA Take the Lead in Transitioning to FOPLP for PC CPU, PMIC, and AI GPU to Reduce Cost and Expand Packaging Sizes of Large-Sized Chips

Jun 27, 2024 | PDF

As indicated by the survey of global market intelligence firm TrendForce, chip suppliers such as AMD have been actively involved in negotiations with TSMC and OSAT throughout 2Q24 on chip packaging us...

Foundry Market Bulletin_20240624 | TrendForce

Foundry Market Bulletin_20240624

Jun 24, 2024 | PDF

TSMC’s capacity for 3nm is now under an exceedingly short supply in 2H24 after the full incorporation by the iPhone 16 series and new PC platforms such as Intel’s Arrow Lake/Lunar Lake...

From 2.5D to 3D: Key Processes of Hybrid Bonding and Strategies of Equipment Providers | TrendForce

From 2.5D to 3D: Key Processes of Hybrid Bonding and Strategies of Equipment Providers

Jun 05, 2024 | PDF

Under the influence of growing AI-related demand and the slowing pace of node migration under Moore’s Law, achieving lower power consumption and higher transistor counts on a single chip has become a...

Foundry Market Bulletin_20240527 | TrendForce

Foundry Market Bulletin_20240527

May 27, 2024 | PDF

Samsung Foundry generated US$3.36 billion of revenue in 1Q24 at an approximate QoQ drop of 7.1%, and remained low in capacity utilization primarily due to clients’ off-season stocking activities...

Foundry Market Bulletin_20240513 | TrendForce

Foundry Market Bulletin_20240513

May 13, 2024 | PDF

TSMC pointed out from its earnings call on April 18th that it has officially lowered the projection on the overall foundry industry from a YoY growth of 20% to a mid-to-high-teens% due to the slow rec...

A Glimpse into the Adoption Challenges and Technological Planning of TSMC’s 3nm Technology from the TSMC Techonology Synposium | TrendForce

A Glimpse into the Adoption Challenges and Technological Planning of TSMC’s 3nm Technology from the TSMC Techonology Synposium

May 10, 2024 | PDF

TSMC president C.C. Wei was questioned by analysts about the potential introduction of High-NA EUV during TSMC’s 4Q23 earnings call. He responded, “Because of technology itself is no value. Only when...

Foundry Market Bulletin_20240429 | TrendForce

Foundry Market Bulletin_20240429

Apr 29, 2024 | PDF

US Department of Commerce announced on April 15th that Samsung’s US fab has been awarded with a direct funding of US$6.4 billion, which accounts for approximately 14.2% of the particular project...

Foundry Market Bulletin_20240415 | TrendForce

Foundry Market Bulletin_20240415

Apr 15, 2024 | PDF

TSMC generated US$18.86 billion (calculation based on US$1=NT$31.4458) of revenue in 1Q24 at an approximate QoQ drop of 4.1%, which coincided with the upper end of the...

Foundry Market Bulletin_20240401 | TrendForce

Foundry Market Bulletin_20240401

Apr 01, 2024 | PDF

Samsung’s new fab (Line S6) in Taylor has planned for a total capacity of roughly 70-80Kwspm, with phase 1 currently focused on 4nm at a planned capacity of around 30Kwspm...

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