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TSMC’s Fab14 P7 in the Southern Taiwan Science Park suffered a power outage on April 14th. The cause of the power outage was an accidental severing of an underground power cable during construction work nearby. According to TrendForce’s latest investigations, the facility accounts for around 4% of TSMC’s total 12-inch wafer foundry capacity and around 2% of the global 12-inch wafer foundry capacity, and TSMC is still assessing the exact figures for the wafers that have to be scrapped and the wafers that can be reworked. According to the latest available information, power was fully restored to the fab site at 7:30 p.m. on April 14th. The diesel uninterruptible power supply (DUPS) of the facility kicked in instantly when the power cable was cut, but there was still a short period of power interruption and voltage drop. As a result, some of the equipment systems in the facility temporarily experienced operational irregularity or malfunction. Based on past experiences with this type of incident, TrendForce believes that it will take 2-7 days to recalibrate the equipment systems so that they can return to normal operation.
As the global economy enters the post-pandemic era, technologies including 5G, WiFi6/6E, and HPC (high-performance computing) have been advancing rapidly, in turn bringing about a fundamental, structural change in the semiconductor industry as well, according to TrendForce’s latest investigations. While the demand for certain devices such as notebook computers and TVs underwent a sharp uptick due to the onset of the stay-at-home economy, this demand will return to pre-pandemic levels once the pandemic has been brought under control as a result of the global vaccination drive. Nevertheless, the worldwide shift to next-gen telecommunication standards has brought about a replacement demand for telecom and networking devices, and this demand will continue to propel the semiconductor industry, resulting in high capacity utilization rates across the major foundries. As certain foundries continue to expand their production capacities this year, TrendForce expects total foundry revenue to reach a historical high of US$94.6 billion this year, an 11% growth YoY.
The LED video wall driver IC market has been suffering from insufficient production capacities on the supply side since 2020, according to TrendForce’s latest investigations. In order to ensure a sufficient level of wafer capacities at foundries, LED video wall driver IC suppliers therefore began raising prices for certain driver IC products by about 5-10% at the end of last year, and this price hike is expected to persist through 2021 as well. On the demand side, various commercial activities and sporting events have been successively resuming as the COVID-19 pandemic is gradually brought under control. The resumption of these activities is expected to drive global LED video wall driver IC revenue for 2021 to US$360 million, a 13% growth YoY.
Enterprise demand for cloud services has been rising steady in the past two years owing to the rapidly changing global markets and uncertainties brought about by the COVID-19 pandemic. TrendForce’s investigations find that most enterprises have been prioritizing cloud service adoption across applications ranging from AI to other emerging technologies as cloud services have relatively flexible costs. Case in point, demand from clients in the hyperscale data center segment constituted more than 40% of total demand for servers in 4Q20, while this figure may potentially approach 45% for 2021. For 2021, TrendForce expects global server shipment to increase by more than 5% YoY and ODM Direct server shipment to increase by more than 15% YoY.
In response to consumers’ growing emphasis on camera performance as a major selling point of smartphones, smartphone brands have successively released multi-camera handsets to target this rising demand and seize market shares, in turn driving up the annual shipment volume of smartphone camera modules, according to TrendForce’s latest investigations. Case in point, despite the COVID-19 pandemic’s impact on the smartphone market in 2020, total smartphone camera module shipment still underwent a 3% growth YoY due to the increasing number of camera modules featured per handset as a result of smartphone brands’ competition over camera hardware. Given that the upward trajectory of smartphone camera module shipment will likely persist this year, TrendForce therefore forecasts an annual shipment volume of 5.07 billion units for 2021, an 11% growth YoY.
