Monthly Archives: April 2025

[News] China Rumored to Speed up Semiconductor Integration, as it Aims to Merge 200 Chipmaking Tool Firms into 10

Posted on 2025-04-28 by TrendForce

With the U.S. tightening chip export controls, China is reportedly exploring a more drastic solution. According to Korean media outlet etnews, the Chinese government is pushing to consolidate the country’s semiconductor equipment companies into about 10 key players. The report …

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Posted in IC Manufacturing, Package&Test, Semiconductors | Tagged , | Leave a comment

[News] Huawei Reportedly Set to Test New Ascend 910D AI Chip as Early as May, Aiming to Challenge NVIDIA

Posted on 2025-04-28 by TrendForce

According to the Wall Street Journal, Huawei is reportedly preparing to test its latest and most advanced AI processor, which it hopes could serve as a replacement for some of NVIDIA’s high-end products. The report, citing sources, states that Huawei …

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[News] NVIDIA Reportedly Kicks off B300 Production Preparation in May, Boosting TSMC’s 5nm and CoWoS-L

Posted on 2025-04-28 by TrendForce

At TSMC’s North America Technology Symposium, the foundry giant rolled out an ambitious roadmap for its CoWoS technology. Meanwhile, major customer NVIDIA is showing signs of strong momentum too. According to Commercial Times, NVIDIA’s production schedule for its B300 series …

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[News] Intel Announced Partnerships with Black Sesame, Model Best and BOS Semiconductors

Posted on 2025-04-28 by TrendForce

During the 2025 Shanghai Auto Show, Intel announced new partnerships with companies including Black Sesame Technologies, Model Best, and BOS Semiconductors, aiming to collaboratively cross technological hurdles in the automotive intelligence process and build an open, mutually beneficial smart vehicle …

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Posted in Automotive Technologies, Emerging Technologies, Semiconductors | Tagged | Leave a comment

[News] Following JEDEC’s HBM4 Standard: What’s Next for SK hynix, Samsung, and Micron?

Posted on 2025-04-28 by TrendForce

As memory giants gear up for the next-gen HBM battle, JEDEC has officially released the JESD270-4 HBM4 standard in mid-April. With AI models and HPC workloads demanding faster, larger memory, HBM4 is arriving just right on time. As per JEDEC’s …

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