Breakthroughs Still Needed in Critical Equipment: China’s Alternative Paths to Advanced Chip Independence

Last Modified

2025-05-22

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Summary
This report tracks the current restrictions on semiconductor technology faced by Chinese companies, analyzes recent developments in China’s semiconductor equipment sector, and ultimately focuses on how Chinese firms are exploring alternative strategies to counter U.S. controls on semiconductor technology.

Table of Contents
1. Intensifying U.S.-China Tensions Make Domestic Innovation China’s Main Strategy

2. IC Manufacturing and Design Face Major Barriers, Making It Hard for Chinese Firms to Access Advanced Chips

3. Progress in Four Major Equipment Areas, But Ion Implantation and Lithography Remain Bottlenecks

4. Chip Interconnects and Advanced Packaging: China’s Next Battleground to Counter Tech Blockades

5. TRI’s View
(1) Chinese chips are essential to overcoming U.S. technology blockades, but the crux lies in
semiconductor manufacturing equipment
(2) From 2025 to 2028, China’s semiconductor industry will focus on two main strategies to
counter technological restrictions

＜Total Pages：13＞