AI chipmakers are adopting custom HBM as base dies move to advanced logic nodes, strengthening TSMC's role in the HBM supply chain.
US and China CSPs keep expanding AI infrastructure with GPU racks and in-house ASICs, lifting 2027 shipments despite supply risks.
Hybrid Bonding is set to become a long-term DRAM trend, driven by scaling and bandwidth requirement, though timing depends on yield and cost.
Fourth-quarter contract price hikes are set to narrow as spot prices stay range-bound, while hybrid bonding replaces layer stacking as the key to NAND speed and cost.
Major economies face mounting debt and inflation, curbing Q4 consumer electronics demand. Yet AI servers are expanding needs for high-capacitance MLCCs through rising CPU and DDR5 adoption. High-end s...
Samsung speeds 8-inch cuts, plans 2027 hikes; AI demand lifts mature nodes as SMIC, Nexchip, HuaHong raise prices, expand.
HBM shortages push AI chipmakers to cut stack heights, making 8hi mainstream from 2H27 while 12hi share declines.
With our expertise in the memory market, this provides a comprehensive analysis and forecast on HBM market share, ASP, wafer capacity, demand consumption, etc.
TrendForce has raised the capex forecast for major US and Chinese CSPs. With memory contract prices remaining elevated, memory spending is set to exceed half of total capex, while suppliers are priori...
TrendForce offers you a complete analysis on DRAM industry supply/demand sufficiency, cost analysis and price forecast.
Agentic AI and inference reshape workloads, lifting server CPU demand. Shipments surge as CSP in-house Arm CPUs erode x86 share.
Rising memory prices curb next year's smartphone output, eased by pulled and downgraded parts; server demand props up quotes, but ample consumer inventory leaves trading thin.
TrendForce offers you a complete analysis on NAND Flash industry supply/demand sufficiency, cost analysis and price forecast.
AI and advanced nodes are driving a paradigm shift in process control. Although GAA, HBM, and advanced packaging follow different paths, all share one logic: testing costs far less than failure. This...
Inference demand drives CSP ASIC growth past GPUs; Google's next TPU adopts EMIB-T, with substrate yield key to cost.
