CSPs scale ASICs alongside GPUs, lifting packaging demand as CoWoS-L leads while EMIB-T and FOPLP emerge as new options.
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NVIDIA's strategic investment in Lumentum and Coherent secures critical InP laser and high‑power CW light‑source capacity, shifting supply‑chain focus from module assembly to upstream optical componen...
"TrendForce's 2024 OSAT report highlights packaging's rising importance due to Moore's Law limits and chip complexity. Asian firms dominate, with Taiwan maintaining...
According to the global market intelligence firm TrendForce, as the limitations of Moore’s Law become more apparent, IC packaging and testing have become critical for the continued...
TrendForce indicates that the US export control updates on January 16th extend KYC review standards to packaging technologies and expand controls to logic ICs at 16/14nm and below, 3D NAND with 128+ l...
(a) incentives for chip makers to adopt FOPLP solution: AI GPU makers pursuing chip packaging size expansion could adopt chip-last solution, while power IC and RF IC makers pursuing packaging cost red...
As indicated by the survey of global market intelligence firm TrendForce, chip suppliers such as AMD have been actively involved in negotiations with TSMC and OSAT throughout 2Q24 on chip packaging us...
