Optical Module

US Data Center Buildout Faces Midterm Risks | TrendForce

US Data Center Buildout Faces Midterm Risks

Oct 07, 2026 | PDF

US hyperscalers keep expanding, but midterm-driven backlash may raise costs and delay permits for later-stage projects.

CIOE 2026 Exhibit Report- Near-Eye Display | TrendForce

CIOE 2026 Exhibit Report- Near-Eye Display

Sep 22, 2026 | PDF

This exhibition report focuses on two key components of near-eye displays—light engines and waveguides. By tracking the product development and capacity expansion of major suppliers, the report provid...

2026 Micro LED Display and Non-Display Application Market Analysis | TrendForce

2026 Micro LED Display and Non-Display Application Market Analysis

Sep 15, 2026 | PDF

This report uncovers the overall Micro LED market size and provides an in-depth analysis of distinct Micro LED applications and manufacturer dynamics, spanning various glass-based display applications...

MLCC Market Bulletin - Aug. 20, 2026 | TrendForce

MLCC Market Bulletin - Aug. 20, 2026

Aug 20, 2026 | PDF

Samsung Electro-Mechanics leads MLCC price hikes to OEMs and ODMs, lifting quotes for consumer and AI-grade parts while raising utilization at Taiwanese and Chinese makers, officially starting an indu...

3Q26 AI Diamond Datasheet | TrendForce

3Q26 AI Diamond Datasheet

Jul 31, 2026 | EXCEL

Leveraging TrendForce’s extensive research on the AI supply chain, this report expands its focus to high-growth cloud service providers (CSPs). It offers comprehensive medium-to-long-term forecasts fo...

Optical Interconnect Supply Chain Restructuring and Opportunities in Response to Expanded US Export Controls | TrendForce

Optical Interconnect Supply Chain Restructuring and Opportunities in Response to Expanded US Export Controls

Apr 30, 2026 | PDF

As U.S. export controls extend from chips to AI infrastructure, the traditional optical interconnect industry is undergoing supply chain restructuring. While optical modules are not subject to blanket...

AI Interconnect Outlook: NVIDIA Leads the Transition to CPO and Silicon Photonics Architectures | TrendForce

AI Interconnect Outlook: NVIDIA Leads the Transition to CPO and Silicon Photonics Architectures

Apr 16, 2026 | PDF

NVIDIA shifts AI competition from computing performance to system interconnects, leveraging CPO and silicon photonics to break I/O bottlenecks. By integrating high-speed fabric with advanced packaging...

AI Infra Market Bulletin - Mar. 12, 2026 | TrendForce

AI Infra Market Bulletin - Mar. 12, 2026

Mar 12, 2026 | PDF

NVIDIA's strategic investment in Lumentum and Coherent secures critical InP laser and high‑power CW light‑source capacity, shifting supply‑chain focus from module assembly to upstream optical componen...

Google's Data Center Interconnect Architecture: Rise of 800G+ Optical Modules and 2026 Supply Chain Outlook | TrendForce

Google's Data Center Interconnect Architecture: Rise of 800G+ Optical Modules and 2026 Supply Chain Outlook

Feb 26, 2026 | PDF

1. Google is consolidating its proprietary TPUs, Ironwood racks, 3D Torus topology, and the Apollo OCS optical backbone into a unified high-speed interconnect architecture. As a result, the focus of c...

AI Infra Market Bulletin - Jan. 29, 2026 | TrendForce

AI Infra Market Bulletin - Jan. 29, 2026

Jan 29, 2026 | PDF

Google integrates TPU v7/v8, Ironwood racks, and Apollo OCS into a unified fabric, shifting the scaling unit from servers to racks. This drives 800G+ optical module penetration above 60% by 2026. Supp...

2025 Global AI Data Center Interconnect Trends | TrendForce

2025 Global AI Data Center Interconnect Trends

Oct 20, 2025 | PDF

AI-driven data centers evolve from single-chip to heterogeneous multi-GPU architectures. High-speed optical interconnects enable scalability, while silicon photonics and co-packaged optics boost bandw...

AI/HPC Boost Co-Packaged Optics (CPO) Market Opportunities after 2025 | TrendForce

AI/HPC Boost Co-Packaged Optics (CPO) Market Opportunities after 2025

Nov 11, 2024 | PDF

Content: 1. Global AI Server Market Forecast 2. Introduction of Transceiver 3. Transformation from Pluggable Transceiver Optics to CPO 4. Dynamics of the CPO Development 5. Key Takeaways

LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks | TrendForce

LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks

Jun 14, 2024 | PDF

Optical module is an indispensable component for achieving optical communication. However, corresponding issues are becoming increasingly apparent alongside the continuously climbing usage and growing...

Rise of Silicon Photonics and CPO Technology Innovating Light Communication Solutions | TrendForce

Rise of Silicon Photonics and CPO Technology Innovating Light Communication Solutions

Mar 04, 2024 | PDF

As global internet data transmission volume continues to reach new highs, the performance bottleneck of light communication solutions becomes increasingly apparent. This report, on the one hand, explo...

Global GaAs Industry: Overview | TrendForce

Global GaAs Industry: Overview

Dec 11, 2023 | PDF

Gallium Arsenide (GaAs) is recognized in the industry as the most mature compound semiconductor material after silicon. It possesses superior characteristics such as high frequency, high electron mobi...

Get in touch with us


Get in touch with us