Optical Communication

AI Infra Market Bulletin - Mar. 12, 2026 | TrendForce

AI Infra Market Bulletin - Mar. 12, 2026

Mar 12, 2026 | PDF

NVIDIA's strategic investment in Lumentum and Coherent secures critical InP laser and high‑power CW light‑source capacity, shifting supply‑chain focus from module assembly to upstream optical componen...

Google's Data Center Interconnect Architecture: Rise of 800G+ Optical Modules and 2026 Supply Chain Outlook | TrendForce

Google's Data Center Interconnect Architecture: Rise of 800G+ Optical Modules and 2026 Supply Chain Outlook

Feb 26, 2026 | PDF

1. Google is consolidating its proprietary TPUs, Ironwood racks, 3D Torus topology, and the Apollo OCS optical backbone into a unified high-speed interconnect architecture. As a result, the focus of c...

1Q26 Server Market Report | TrendForce

1Q26 Server Market Report

Feb 04, 2026 | PDF

Global Server Market – Trends and Outlook for 1Q26

SPIE Photonics West 2026 Exhibit Report | TrendForce

SPIE Photonics West 2026 Exhibit Report

Feb 02, 2026 | PDF

SPIE Photonics West 2026, the world’s largest annual event for the optics and photonics industry, took place from 17-22 January in San Francisco. The exhibition features a wide array of topics, includ...

AI Infra Market Bulletin - Jan. 29, 2026 | TrendForce

AI Infra Market Bulletin - Jan. 29, 2026

Jan 29, 2026 | PDF

Google integrates TPU v7/v8, Ironwood racks, and Apollo OCS into a unified fabric, shifting the scaling unit from servers to racks. This drives 800G+ optical module penetration above 60% by 2026. Supp...

CPO Testing Revolution: Market Opportunities in Co-Packaged Optics Validation | TrendForce

CPO Testing Revolution: Market Opportunities in Co-Packaged Optics Validation

Jan 28, 2026 | PDF

As Co-Packaged Optics (CPO) moves from the lab toward commercialization, inspection has become the key to achieving mass producibility and long-term system stability. However, CPO inspection still fac...

From GPON to High-End PON: Global Next-Generation Fiber Network Commercialization Deep Dive | TrendForce

From GPON to High-End PON: Global Next-Generation Fiber Network Commercialization Deep Dive

Dec 04, 2025 | PDF

The need for upgraded passive optical network (PON) technology is accelerating as global residential and enterprise demand for FTTH continues to surge. Driven by policy initiatives, China and the U.S....

AI Optical Networks Evolution: 2025 Efficiency and Sustainability Insights | TrendForce

AI Optical Networks Evolution: 2025 Efficiency and Sustainability Insights

Nov 17, 2025 | PDF

The rapid rise of GenAI is driving an explosive surge in global demand for computing power and data-center construction. Optical networks have become essential to enabling the high-bandwidth, low-late...

2025 Global AI Data Center Interconnect Trends | TrendForce

2025 Global AI Data Center Interconnect Trends

Oct 20, 2025 | PDF

AI-driven data centers evolve from single-chip to heterogeneous multi-GPU architectures. High-speed optical interconnects enable scalability, while silicon photonics and co-packaged optics boost bandw...

Optical Network Technology Evolution and Global Industry Chain Dynamics: 2025 Outlook | TrendForce

Optical Network Technology Evolution and Global Industry Chain Dynamics: 2025 Outlook

Aug 05, 2025 | PDF

This report examines the development trends of optical networks under the dual drivers of high-speed communications and AI applications, covering technology evolution, application scenarios, and shift...

Glass Substrate Breakthroughs: Driving CoWoS and CPO Innovation | TrendForce

Glass Substrate Breakthroughs: Driving CoWoS and CPO Innovation

Jul 07, 2025 | PDF

Glass substrates are emerging as a highly promising solution in advanced semiconductor packaging with recent breakthroughs in Through-Glass Via (TGV) technology. They are poised to drive innovation in...

AI/HPC Boost Co-Packaged Optics (CPO) Market Opportunities after 2025 | TrendForce

AI/HPC Boost Co-Packaged Optics (CPO) Market Opportunities after 2025

Nov 11, 2024 | PDF

Content: 1. Global AI Server Market Forecast 2. Introduction of Transceiver 3. Transformation from Pluggable Transceiver Optics to CPO 4. Dynamics of the CPO Development 5. Key Takeaways

AI/HPC Boost Co-Packaged Optics (CPO)  Market Opportunities after 2025 | TrendForce

AI/HPC Boost Co-Packaged Optics (CPO) Market Opportunities after 2025

Nov 11, 2024 | PDF

Global AI Server Market Forecast Introduction of Transceiver Transformation from Pluggable Transceiver Optics to CPO Dynamics of the CPO Development Key Takeaways

LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks | TrendForce

LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks

Jun 14, 2024 | PDF

Optical module is an indispensable component for achieving optical communication. However, corresponding issues are becoming increasingly apparent alongside the continuously climbing usage and growing...

Trends in Global Silicon Photonics Industry | TrendForce

Trends in Global Silicon Photonics Industry

Apr 12, 2024 | PDF

Silicon photonics, which emerges from the synthesis of silicon-based integrated circuits and semiconductor lasers, plays a pivotal role in advancing semiconductor technologies. This report aims to ana...

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