AI chipmakers are adopting custom HBM as base dies move to advanced logic nodes, strengthening TSMC's role in the HBM supply chain.
Agility Robotics is tapping the public market through a SPAC merger with real deployment experience but still-small revenue and heavy spending, while Unitree's post-listing share price correction show...
US and China CSPs keep expanding AI infrastructure with GPU racks and in-house ASICs, lifting 2027 shipments despite supply risks.
Hybrid Bonding is set to become a long-term DRAM trend, driven by scaling and bandwidth requirement, though timing depends on yield and cost.
Fourth-quarter contract price hikes are set to narrow as spot prices stay range-bound, while hybrid bonding replaces layer stacking as the key to NAND speed and cost.
Major economies face mounting debt and inflation, curbing Q4 consumer electronics demand. Yet AI servers are expanding needs for high-capacitance MLCCs through rising CPU and DDR5 adoption. High-end s...
Samsung speeds 8-inch cuts, plans 2027 hikes; AI demand lifts mature nodes as SMIC, Nexchip, HuaHong raise prices, expand.
HBM shortages push AI chipmakers to cut stack heights, making 8hi mainstream from 2H27 while 12hi share declines.
Driven by expanding AI clusters and surging bandwidth, the AI networking market will reach US$269.5B by 2027 (92% CAGR from 2024). Growth is extending from back-end networks to high-speed accelerator...
Agentic AI and inference reshape workloads, lifting server CPU demand. Shipments surge as CSP in-house Arm CPUs erode x86 share.
Rising memory prices curb next year's smartphone output, eased by pulled and downgraded parts; server demand props up quotes, but ample consumer inventory leaves trading thin.
AI and advanced nodes are driving a paradigm shift in process control. Although GAA, HBM, and advanced packaging follow different paths, all share one logic: testing costs far less than failure. This...
Inference demand drives CSP ASIC growth past GPUs; Google's next TPU adopts EMIB-T, with substrate yield key to cost.
Oil prices and inflation dampen year-end consumer spending, leading to a divergence in consumer MLCCs where low-capacitance items weaken while high-capacitance items strengthen. AI servers and automot...
CSP and Neocloud demand lifts the AI server outlook as NVIDIA shifts to VR200, AMD and ASICs gain, and cooling upgrades.
